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Mold-pressed inorganic adhesive benzene particle thermal insulation board and preparation method thereof
The invention relates to the technical field of building fireproof thermal insulation materials, and in particular, relates to a mold-pressed inorganic adhesive benzene particle thermal insulation board and a preparation method thereof. The mold-pressed inorganic adhesive benzene particle thermal insulation board comprises polystyrene particles, an interface agent and inorganic flame-retardant slurry; the polystyrene particles are subjected to interface treatment by adopting an interface agent generator, are mixed with the inorganic flame-retardant slurry, are stirred to prepare adhesive benzene particle slurry, and are subjected to pressure maintaining curing in a mold box to prepare an adhesive benzene particle blank; and then cutting is performed to prepare the mold-pressed inorganic adhesive benzene particle thermal insulation board. According to the technology, the bonding strength of the polystyrene particles and the inorganic flame-retardant slurry is improved, the proportion of the inorganic flame-retardant slurry is optimized, the components of the inorganic thermal insulation particles are increased, the compression ratio in the mold box is increased, and the produced mold-pressed inorganic polystyrene particle thermal insulation board is higher in strength and better in flame-retardant effect; and the thermal insulation performance is obviously improved.
本发明涉及建筑防火保温材料技术领域，具体为一种模压无机胶苯颗粒保温板及其制备方法。一种模压无机胶苯颗粒保温板，包括：聚苯乙烯颗粒、界面剂和无机阻燃浆料，采用界面剂发生器对聚苯乙烯颗粒进行界面处理，与无机阻燃浆料混合、搅拌制成胶苯颗粒浆料，在模箱内保压养护制成胶苯颗粒胚体，再切割制成模压无机胶苯颗粒保温板。本技术提高了聚苯乙烯颗粒与无机阻燃浆料的粘结强度，并对无机阻燃浆料的配比进行了优化，增加了无机保温颗粒的组份，提高了模箱内的压缩比，生产的模压无机胶苯颗粒保温板强度更高，阻燃效果更好，并且保温性能得到了明显的改善。
Mold-pressed inorganic adhesive benzene particle thermal insulation board and preparation method thereof
The invention relates to the technical field of building fireproof thermal insulation materials, and in particular, relates to a mold-pressed inorganic adhesive benzene particle thermal insulation board and a preparation method thereof. The mold-pressed inorganic adhesive benzene particle thermal insulation board comprises polystyrene particles, an interface agent and inorganic flame-retardant slurry; the polystyrene particles are subjected to interface treatment by adopting an interface agent generator, are mixed with the inorganic flame-retardant slurry, are stirred to prepare adhesive benzene particle slurry, and are subjected to pressure maintaining curing in a mold box to prepare an adhesive benzene particle blank; and then cutting is performed to prepare the mold-pressed inorganic adhesive benzene particle thermal insulation board. According to the technology, the bonding strength of the polystyrene particles and the inorganic flame-retardant slurry is improved, the proportion of the inorganic flame-retardant slurry is optimized, the components of the inorganic thermal insulation particles are increased, the compression ratio in the mold box is increased, and the produced mold-pressed inorganic polystyrene particle thermal insulation board is higher in strength and better in flame-retardant effect; and the thermal insulation performance is obviously improved.
本发明涉及建筑防火保温材料技术领域，具体为一种模压无机胶苯颗粒保温板及其制备方法。一种模压无机胶苯颗粒保温板，包括：聚苯乙烯颗粒、界面剂和无机阻燃浆料，采用界面剂发生器对聚苯乙烯颗粒进行界面处理，与无机阻燃浆料混合、搅拌制成胶苯颗粒浆料，在模箱内保压养护制成胶苯颗粒胚体，再切割制成模压无机胶苯颗粒保温板。本技术提高了聚苯乙烯颗粒与无机阻燃浆料的粘结强度，并对无机阻燃浆料的配比进行了优化，增加了无机保温颗粒的组份，提高了模箱内的压缩比，生产的模压无机胶苯颗粒保温板强度更高，阻燃效果更好，并且保温性能得到了明显的改善。
Mold-pressed inorganic adhesive benzene particle thermal insulation board and preparation method thereof
一种模压无机胶苯颗粒保温板及其制备方法
CHEN JUN (author) / ZHAO TONGFENG (author) / LI LEI (author)
2022-02-22
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
B28C
Tonaufbereitung
,
PREPARING CLAY
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