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A platform for research: civil engineering, architecture and urbanism
Ceramic thin film substrate for high-reliability thin film hybrid integrated circuit and manufacturing method
The invention relates to a ceramic thin film substrate for a high-reliability thin film hybrid integrated circuit and a manufacturing method. The manufacturing method comprises the following steps: forming a thin film resistance layer, a barrier layer and a thin gold seed crystal layer on a substrate in sequence; forming a gold conduction band on the thin gold seed crystal layer; removing the thin gold seed crystal layer; a nickel layer is formed in the to-be-nickel-plated area; covering a bonding pad gold layer on the nickel layer in the bonding pad area; forming a thin-film resistor network; and forming a nickel passivation layer. In the invention, a gold conduction band and a nickel-chromium-silicon thin-film resistor network are respectively formed on an aluminum oxide ceramic substrate by adopting a magnetron sputtering technology, a photoetching technology, a microelectronic electroplating technology, a photoresist removing technology, a corrosion technology and a heat treatment technology, and a nickel-gold burn-in pad and a solder mask layer are overlaid on the gold conduction band; the manufactured thin film substrate is thick in gold layer, high in line width precision and steep in step morphology, and can meet the application requirements of high precision, high frequency and high reliability; the substrate structure is compatible with a standard micro-assembly process and can be widely applied to the field of thin film hybrid integrated circuits.
本发明涉及一种用于高可靠薄膜混合集成电路的陶瓷薄膜基板及制作方法，包括在基板上依次形成薄膜电阻层、阻挡层和薄金籽晶层；在薄金籽晶层上形成金导带；去除薄金籽晶层；在待镀镍区域形成镍层；在焊盘区域的镍层上履盖焊盘金层；形成薄膜电阻网络；形成镍钝化层。本发明中，在氧化铝陶瓷基板上采用磁控溅射、光刻技术、微电子电镀工艺、去胶、腐蚀技术和热处理工艺技术，分别形成金导带、镍铬硅薄膜电阻网络，并在金导带上叠加镍金烧焊焊盘及阻焊层，制作的薄膜基板金层厚度厚、线宽精度高、台阶形貌陡直，可以满足高精度、高频和高可靠应用要求；基板结构兼容标准微组装工艺，可广泛应用于薄膜混合集成电路领域。
Ceramic thin film substrate for high-reliability thin film hybrid integrated circuit and manufacturing method
The invention relates to a ceramic thin film substrate for a high-reliability thin film hybrid integrated circuit and a manufacturing method. The manufacturing method comprises the following steps: forming a thin film resistance layer, a barrier layer and a thin gold seed crystal layer on a substrate in sequence; forming a gold conduction band on the thin gold seed crystal layer; removing the thin gold seed crystal layer; a nickel layer is formed in the to-be-nickel-plated area; covering a bonding pad gold layer on the nickel layer in the bonding pad area; forming a thin-film resistor network; and forming a nickel passivation layer. In the invention, a gold conduction band and a nickel-chromium-silicon thin-film resistor network are respectively formed on an aluminum oxide ceramic substrate by adopting a magnetron sputtering technology, a photoetching technology, a microelectronic electroplating technology, a photoresist removing technology, a corrosion technology and a heat treatment technology, and a nickel-gold burn-in pad and a solder mask layer are overlaid on the gold conduction band; the manufactured thin film substrate is thick in gold layer, high in line width precision and steep in step morphology, and can meet the application requirements of high precision, high frequency and high reliability; the substrate structure is compatible with a standard micro-assembly process and can be widely applied to the field of thin film hybrid integrated circuits.
本发明涉及一种用于高可靠薄膜混合集成电路的陶瓷薄膜基板及制作方法，包括在基板上依次形成薄膜电阻层、阻挡层和薄金籽晶层；在薄金籽晶层上形成金导带；去除薄金籽晶层；在待镀镍区域形成镍层；在焊盘区域的镍层上履盖焊盘金层；形成薄膜电阻网络；形成镍钝化层。本发明中，在氧化铝陶瓷基板上采用磁控溅射、光刻技术、微电子电镀工艺、去胶、腐蚀技术和热处理工艺技术，分别形成金导带、镍铬硅薄膜电阻网络，并在金导带上叠加镍金烧焊焊盘及阻焊层，制作的薄膜基板金层厚度厚、线宽精度高、台阶形貌陡直，可以满足高精度、高频和高可靠应用要求；基板结构兼容标准微组装工艺，可广泛应用于薄膜混合集成电路领域。
Ceramic thin film substrate for high-reliability thin film hybrid integrated circuit and manufacturing method
用于高可靠薄膜混合集成电路的陶瓷薄膜基板及制作方法
YE DONG (author) / SHEN XIAOGANG (author) / LUO CHI (author) / LIAN DONG (author)
2022-03-01
Patent
Electronic Resource
Chinese
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