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Porous ceramic-based grinding block for grinding semiconductor plastic package substrate and manufacturing method of porous ceramic-based grinding block
The invention discloses a porous ceramic-based grinding block for grinding a semiconductor plastic package substrate and a manufacturing method of the porous ceramic-based grinding block, the porous ceramic-based grinding block comprises the following components in percentage by mass: 35-50% of a ceramic bond, 35-50% of diamond powder, 10-20% of an aluminum ball pore-forming agent and 5-10% of an auxiliary agent, and the porous ceramic-based grinding block is prepared by mixing, compression molding, heat treatment and sintering; an aluminum ball pore-forming agent is adopted, in the sintering process, when the temperature rises to the aluminum melting point (660 DEG C) or above, aluminum balls are gradually molten, molten liquid gradually permeates into gaps of a nearby ceramic bonding agent, the original positions of the aluminum balls are changed into round holes, along with prolonging of heat preservation time, the molten aluminum is gradually oxidized into aluminum oxide solids, and the positions occupied by the aluminum balls are changed into hollow holes; and moreover, no gas is generated in the whole process, so that the derivative problems of deformation, cracking and the like caused by a pore-forming agent in the prior art are avoided, and the stability and the consistency of the product quality are ensured.
本发明公开一种半导体塑封基板研磨用多孔陶瓷基研磨块及其制造方法，多孔陶瓷基研磨块由包含质量百分比分别为35‑50％陶瓷结合剂、35‑50％金刚石粉体、10‑20％铝球造孔剂和5‑10％辅助剂，经混料、压制成型、热处理和烧结后制成；采用铝球造孔剂，在烧结过程当温度升至铝熔点(660℃)之上，铝球逐步熔化，熔化的液体逐步渗入旁边陶瓷结合剂的缝隙中，铝球原来的位置变为圆形孔，随着保温时间的延长，铝液逐渐氧化成氧化铝固体，铝球原理所占的位置变成空心孔，达到造孔的目的，而且在整个过程中不产生气体，避免现有技术中造孔剂造成的变形、开裂等衍生问题，保证了产品品质的稳定性与一致性。
Porous ceramic-based grinding block for grinding semiconductor plastic package substrate and manufacturing method of porous ceramic-based grinding block
The invention discloses a porous ceramic-based grinding block for grinding a semiconductor plastic package substrate and a manufacturing method of the porous ceramic-based grinding block, the porous ceramic-based grinding block comprises the following components in percentage by mass: 35-50% of a ceramic bond, 35-50% of diamond powder, 10-20% of an aluminum ball pore-forming agent and 5-10% of an auxiliary agent, and the porous ceramic-based grinding block is prepared by mixing, compression molding, heat treatment and sintering; an aluminum ball pore-forming agent is adopted, in the sintering process, when the temperature rises to the aluminum melting point (660 DEG C) or above, aluminum balls are gradually molten, molten liquid gradually permeates into gaps of a nearby ceramic bonding agent, the original positions of the aluminum balls are changed into round holes, along with prolonging of heat preservation time, the molten aluminum is gradually oxidized into aluminum oxide solids, and the positions occupied by the aluminum balls are changed into hollow holes; and moreover, no gas is generated in the whole process, so that the derivative problems of deformation, cracking and the like caused by a pore-forming agent in the prior art are avoided, and the stability and the consistency of the product quality are ensured.
本发明公开一种半导体塑封基板研磨用多孔陶瓷基研磨块及其制造方法，多孔陶瓷基研磨块由包含质量百分比分别为35‑50％陶瓷结合剂、35‑50％金刚石粉体、10‑20％铝球造孔剂和5‑10％辅助剂，经混料、压制成型、热处理和烧结后制成；采用铝球造孔剂，在烧结过程当温度升至铝熔点(660℃)之上，铝球逐步熔化，熔化的液体逐步渗入旁边陶瓷结合剂的缝隙中，铝球原来的位置变为圆形孔，随着保温时间的延长，铝液逐渐氧化成氧化铝固体，铝球原理所占的位置变成空心孔，达到造孔的目的，而且在整个过程中不产生气体，避免现有技术中造孔剂造成的变形、开裂等衍生问题，保证了产品品质的稳定性与一致性。
Porous ceramic-based grinding block for grinding semiconductor plastic package substrate and manufacturing method of porous ceramic-based grinding block
一种半导体塑封基板研磨用多孔陶瓷基研磨块及其制造方法
YIN PANFENG (author)
2022-04-26
Patent
Electronic Resource
Chinese
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