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Ceramic-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of ceramic-based diamond grinding wheel
The invention discloses a ceramic-based diamond grinding wheel for grinding a semiconductor plastic package body and a manufacturing method of the ceramic-based diamond grinding wheel. The ceramic-based diamond grinding wheel is composed of an aluminum alloy base body and a grinding block bonded to the aluminum alloy base body. The grinding block is prepared from the following components in percentage by mass: 35-50% of a ceramic bond, 35-50% of diamond powder, 10-20% of a pore forming agent and 5-10% of an auxiliary agent through mixing, compression molding, heat treatment and sintering treatment, it is effectively guaranteed that the grinding wheel does not scratch the surface of a product in the using process, the yield is improved, and the product cost of customers is reduced; according to the grinding wheel manufactured by adopting the formula and the process, the service life of the grinding wheel can be effectively prolonged, the replacement period of the grinding wheel is prolonged, the time for replacing the grinding wheel is saved, the production cost of a single product of a customer is reduced, and the product competitiveness is improved.
本发明公开一种半导体塑封体研磨用陶瓷基金刚石磨轮及其制造方法，金刚石磨轮由铝合金基体和粘接在铝合金基体上的研磨块组成；所述研磨块由包含质量百分比分别为35‑50％陶瓷结合剂、35‑50％金刚石粉体、10‑20％造孔剂和5‑10％辅助剂，经混料、压制成型、热处理和烧结处理后得到；有效保证磨轮在使用过程中不划伤产品表面，提升良品率提升，降低客户的产品成本；采用上述配方与工艺制造的磨轮可有效提高磨轮寿命，延长了磨轮更换周期，节约了更换磨轮时间，降低客户单件产品的生产成本，提升了产品竞争力。
Ceramic-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of ceramic-based diamond grinding wheel
The invention discloses a ceramic-based diamond grinding wheel for grinding a semiconductor plastic package body and a manufacturing method of the ceramic-based diamond grinding wheel. The ceramic-based diamond grinding wheel is composed of an aluminum alloy base body and a grinding block bonded to the aluminum alloy base body. The grinding block is prepared from the following components in percentage by mass: 35-50% of a ceramic bond, 35-50% of diamond powder, 10-20% of a pore forming agent and 5-10% of an auxiliary agent through mixing, compression molding, heat treatment and sintering treatment, it is effectively guaranteed that the grinding wheel does not scratch the surface of a product in the using process, the yield is improved, and the product cost of customers is reduced; according to the grinding wheel manufactured by adopting the formula and the process, the service life of the grinding wheel can be effectively prolonged, the replacement period of the grinding wheel is prolonged, the time for replacing the grinding wheel is saved, the production cost of a single product of a customer is reduced, and the product competitiveness is improved.
本发明公开一种半导体塑封体研磨用陶瓷基金刚石磨轮及其制造方法，金刚石磨轮由铝合金基体和粘接在铝合金基体上的研磨块组成；所述研磨块由包含质量百分比分别为35‑50％陶瓷结合剂、35‑50％金刚石粉体、10‑20％造孔剂和5‑10％辅助剂，经混料、压制成型、热处理和烧结处理后得到；有效保证磨轮在使用过程中不划伤产品表面，提升良品率提升，降低客户的产品成本；采用上述配方与工艺制造的磨轮可有效提高磨轮寿命，延长了磨轮更换周期，节约了更换磨轮时间，降低客户单件产品的生产成本，提升了产品竞争力。
Ceramic-based diamond grinding wheel for grinding semiconductor plastic package body and manufacturing method of ceramic-based diamond grinding wheel
一种半导体塑封体研磨用陶瓷基金刚石磨轮及其制造方法
YIN PANFENG (author)
2022-04-26
Patent
Electronic Resource
Chinese
Precision form Grinding of Ceramic Materials with Diamond Grinding Wheel
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