A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
The invention relates to a high-power ceramic chip resistor, a resistor material and preparation thereof. The general chemical formula of the ceramic resistance material is (ZnO) x (MgZnO) 1-x (ZnAl2O4) y (MO) w, x is more than or equal to 0.5 and less than or equal to 1, y is more than 0 and less than or equal to 0.5, M is one or more of rare earth elements, and w is more than or equal to 0 and less than or equal to 0.05. The high-power ceramic chip resistor comprises a ceramic body and electrodes arranged on the two surfaces of the ceramic body, and the ceramic body is made of the ceramic resistor material. The preparation method of the ceramic chip resistor comprises the following steps: preparing raw material powder according to a formula, then carrying out heat preservation at the sintering temperature of 1200-1400 DEG C for 2-15 hours to sinter the raw material powder into a spindle, and then carrying out slicing, electrode printing, electrode sintering and cutting-up to obtain a finished product. The ceramic chip resistor disclosed by the invention can meet the use requirements under the conditions of high energy density such as large current and high voltage, and the preparation process is simple.
本发明涉及一种大功率陶瓷芯片电阻、电阻材料及其制备。所述陶瓷电阻材料的化学通式为(ZnO)x(MgZnO)1‑x(ZnAl2O4)y(MO)w，其中0.5≤x≤1，0＜y≤0.5，M为稀土元素的一种或多种，0≤w≤0.05。所述大功率陶瓷芯片电阻包括瓷体和设于瓷体两表面的电极，所述瓷体采用所述陶瓷电阻材料。所述陶瓷芯片电阻的制备方法包括如下步骤：按配方制备原料粉料，然后在烧结温度1200～1400℃下保温2～15小时将原料粉料烧结成锭子，再进行切片、印刷电极、烧结电极、划切，得到成品。本发明的陶瓷芯片电阻能够满足在大电流、高电压等高能量密度的条件下的使用要求，而且制备工艺简单。
The invention relates to a high-power ceramic chip resistor, a resistor material and preparation thereof. The general chemical formula of the ceramic resistance material is (ZnO) x (MgZnO) 1-x (ZnAl2O4) y (MO) w, x is more than or equal to 0.5 and less than or equal to 1, y is more than 0 and less than or equal to 0.5, M is one or more of rare earth elements, and w is more than or equal to 0 and less than or equal to 0.05. The high-power ceramic chip resistor comprises a ceramic body and electrodes arranged on the two surfaces of the ceramic body, and the ceramic body is made of the ceramic resistor material. The preparation method of the ceramic chip resistor comprises the following steps: preparing raw material powder according to a formula, then carrying out heat preservation at the sintering temperature of 1200-1400 DEG C for 2-15 hours to sinter the raw material powder into a spindle, and then carrying out slicing, electrode printing, electrode sintering and cutting-up to obtain a finished product. The ceramic chip resistor disclosed by the invention can meet the use requirements under the conditions of high energy density such as large current and high voltage, and the preparation process is simple.
本发明涉及一种大功率陶瓷芯片电阻、电阻材料及其制备。所述陶瓷电阻材料的化学通式为(ZnO)x(MgZnO)1‑x(ZnAl2O4)y(MO)w，其中0.5≤x≤1，0＜y≤0.5，M为稀土元素的一种或多种，0≤w≤0.05。所述大功率陶瓷芯片电阻包括瓷体和设于瓷体两表面的电极，所述瓷体采用所述陶瓷电阻材料。所述陶瓷芯片电阻的制备方法包括如下步骤：按配方制备原料粉料，然后在烧结温度1200～1400℃下保温2～15小时将原料粉料烧结成锭子，再进行切片、印刷电极、烧结电极、划切，得到成品。本发明的陶瓷芯片电阻能够满足在大电流、高电压等高能量密度的条件下的使用要求，而且制备工艺简单。
High-power ceramic chip resistor and material and preparation thereof
一种大功率陶瓷芯片电阻及其材料和制备
FANG CHAO (author)
2022-05-13
Patent
Electronic Resource
Chinese
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