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Forming method of high-thermal-conductivity silicon nitride substrate
The invention discloses a forming method of a high-thermal-conductivity silicon nitride substrate, and the forming process comprises the following steps: S1, burdening and ball milling: adding an organic monomer and a cross-linking agent into a solvent to prepare a premixed solution, and then mixing the premixed solution, a dispersing agent, silicon nitride and auxiliary ceramic powder for ball milling; and S2, adding a plasticizer to increase the flexibility of the silicon nitride sheet after tape casting. Then carrying out secondary ball milling, wherein the ball milling time is 4-30 hours; s3, vacuum defoaming: performing vacuum defoaming on the slurry obtained by secondary ball milling, and meanwhile, adding an initiator and stirring; s4, gel tape casting: carrying out tape casting operation on the slurry obtained by vacuum defoaming; and S5, drying the thin sheets, namely drying the thin sheets with certain strength and toughness after being cured for a certain time. According to the preparation method, a gel and tape casting combined technology is adopted, the advantages of two types of forming are integrated, the production cost is reduced, the environmental pollution is reduced, and the preparation of the high-performance silicon nitride ceramic substrate is realized.
本发明公开了一种高导热氮化硅基板的成型方法，成型工艺步骤如下：S1：配料和球磨：将有机单体和交联剂加入溶剂配置呈预混液，然后将预混液、分散剂和氮化硅及助剂陶瓷粉体混合进行球磨；S2：加入增塑剂，增加流延成型后氮化硅薄片的柔韧性。然后进行二次球磨，球磨时间为4h‑30h；S3：真空除泡，将二次球磨得到的浆料进行真空除泡，同时加入引发剂加以搅拌；S4：凝胶流延，将真空除泡得到的浆料进行流延操作；S5：薄片干燥，薄片在固化一定时间后具有一定强度和韧性，进行干燥处理。本发明采用凝胶及流延结合的技术，综合两种成型的优点，降低生产成本，减少环境污染，实现高性能氮化硅陶瓷基片的制备。
Forming method of high-thermal-conductivity silicon nitride substrate
The invention discloses a forming method of a high-thermal-conductivity silicon nitride substrate, and the forming process comprises the following steps: S1, burdening and ball milling: adding an organic monomer and a cross-linking agent into a solvent to prepare a premixed solution, and then mixing the premixed solution, a dispersing agent, silicon nitride and auxiliary ceramic powder for ball milling; and S2, adding a plasticizer to increase the flexibility of the silicon nitride sheet after tape casting. Then carrying out secondary ball milling, wherein the ball milling time is 4-30 hours; s3, vacuum defoaming: performing vacuum defoaming on the slurry obtained by secondary ball milling, and meanwhile, adding an initiator and stirring; s4, gel tape casting: carrying out tape casting operation on the slurry obtained by vacuum defoaming; and S5, drying the thin sheets, namely drying the thin sheets with certain strength and toughness after being cured for a certain time. According to the preparation method, a gel and tape casting combined technology is adopted, the advantages of two types of forming are integrated, the production cost is reduced, the environmental pollution is reduced, and the preparation of the high-performance silicon nitride ceramic substrate is realized.
本发明公开了一种高导热氮化硅基板的成型方法，成型工艺步骤如下：S1：配料和球磨：将有机单体和交联剂加入溶剂配置呈预混液，然后将预混液、分散剂和氮化硅及助剂陶瓷粉体混合进行球磨；S2：加入增塑剂，增加流延成型后氮化硅薄片的柔韧性。然后进行二次球磨，球磨时间为4h‑30h；S3：真空除泡，将二次球磨得到的浆料进行真空除泡，同时加入引发剂加以搅拌；S4：凝胶流延，将真空除泡得到的浆料进行流延操作；S5：薄片干燥，薄片在固化一定时间后具有一定强度和韧性，进行干燥处理。本发明采用凝胶及流延结合的技术，综合两种成型的优点，降低生产成本，减少环境污染，实现高性能氮化硅陶瓷基片的制备。
Forming method of high-thermal-conductivity silicon nitride substrate
一种高导热氮化硅基板的成型方法
ZOU JINGLIANG (author) / XU PENG (author) / ZHUANG XINJIANG (author)
2022-05-27
Patent
Electronic Resource
Chinese
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