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Mildew-proof spliced plate and production process thereof
The invention relates to the field of decorative plates, and particularly discloses a mildew-proof assembled plate and a production process thereof. The production process of the mildew-proof assembled plate comprises the following steps: pretreatment of a base plate: placing the base plate in a closed container, enabling the base plate not to be in contact with the inner wall of the closed container, introducing steam to treat for 20-40 minutes, exhausting to 0.06-0.1 MPa, heating to carbonize, introducing hydrogen at the carbonization temperature of 200-240 DEG C, and cooling to room temperature; a silver nitrate aqueous solution with the mass concentration of 6%-10% is sprayed to the surface of the pretreated substrate, then the substrate is put into low-temperature hydrogen for low-temperature treatment, and the temperature of the low-temperature hydrogen is-260 DEG C to 280 DEG C; and after-treatment of the base plate: drying the base plate subjected to low-temperature treatment, and carrying out surface treatment to prepare the mildew-proof assembled plate. The mildew-proof spliced plate has the advantages of low water absorption, high hydrophobicity and strong antibacterial and mildew-proof properties.
本申请涉及装饰板材领域,具体公开了一种防霉拼装板材及其生产工艺。防霉拼装板材的生产工艺,包括以下不足:基板预处理:将基板置于密闭容器中,基板与密封容器的内壁不接触,通入蒸汽处理20‑40min,排气至0.06‑0.1MPa后,加热碳化并通入氢气,碳化温度为200‑240℃,降温至室温;基板低温处理:向预处理的基板表面喷涂质量浓度为6‑10%的硝酸银水溶液,然后放入低温氢气中进行低温处理,低温氢气的温度为‑(260~280)℃;基板后处理:将经过低温处理的基板干燥,经表面处理,制成防霉拼装板材。本申请的防霉拼装板材具有吸水率低,疏水性高,抗菌防霉性强的优点。
Mildew-proof spliced plate and production process thereof
The invention relates to the field of decorative plates, and particularly discloses a mildew-proof assembled plate and a production process thereof. The production process of the mildew-proof assembled plate comprises the following steps: pretreatment of a base plate: placing the base plate in a closed container, enabling the base plate not to be in contact with the inner wall of the closed container, introducing steam to treat for 20-40 minutes, exhausting to 0.06-0.1 MPa, heating to carbonize, introducing hydrogen at the carbonization temperature of 200-240 DEG C, and cooling to room temperature; a silver nitrate aqueous solution with the mass concentration of 6%-10% is sprayed to the surface of the pretreated substrate, then the substrate is put into low-temperature hydrogen for low-temperature treatment, and the temperature of the low-temperature hydrogen is-260 DEG C to 280 DEG C; and after-treatment of the base plate: drying the base plate subjected to low-temperature treatment, and carrying out surface treatment to prepare the mildew-proof assembled plate. The mildew-proof spliced plate has the advantages of low water absorption, high hydrophobicity and strong antibacterial and mildew-proof properties.
本申请涉及装饰板材领域,具体公开了一种防霉拼装板材及其生产工艺。防霉拼装板材的生产工艺,包括以下不足:基板预处理:将基板置于密闭容器中,基板与密封容器的内壁不接触,通入蒸汽处理20‑40min,排气至0.06‑0.1MPa后,加热碳化并通入氢气,碳化温度为200‑240℃,降温至室温;基板低温处理:向预处理的基板表面喷涂质量浓度为6‑10%的硝酸银水溶液,然后放入低温氢气中进行低温处理,低温氢气的温度为‑(260~280)℃;基板后处理:将经过低温处理的基板干燥,经表面处理,制成防霉拼装板材。本申请的防霉拼装板材具有吸水率低,疏水性高,抗菌防霉性强的优点。
Mildew-proof spliced plate and production process thereof
一种防霉拼装板材及其生产工艺
WANG XIA (author) / NI SHUIMING (author)
2022-05-31
Patent
Electronic Resource
Chinese
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