A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Method for simultaneously sintering two surfaces of copper-clad ceramic substrate
The invention provides a method for simultaneously sintering double surfaces of a copper-clad ceramic substrate, which comprises the following steps of: firstly, placing a matrix gasket on a mesh belt of a sintering furnace, and then, placing a foamed ceramic base plate which does not react with copper and copper oxide; and then the copper sheet, the ceramic sheet and the copper sheet are sequentially stacked on the foamed ceramic base plate for sintering, and after sintering is completed, the double-sided copper-clad ceramic substrate is taken down. The foamed ceramic is used as a sintered base plate material and does not react with the copper sheet in a bonding temperature interval, so that the problems of adhesion of the sintered base plate and the copper sheet and residual sintering marks are solved. Compared with a solid ceramic base plate material, the foamed ceramic is low in heat conductivity coefficient, and the situation that crystal grains of a lower copper sheet are too large is restrained to a certain extent. In addition, the actual contact area of the foaming ceramic and the copper sheet is greatly reduced, and damage of the base plate material to the copper sheet is effectively reduced. The foaming ceramic has good thermal shock resistance, can be recycled, is simple to operate, has no pollution to the product, and can improve the production efficiency and production quality of DCB.
本发明提供覆铜陶瓷基板双面同时烧结方法，先将基体垫片放置于烧结炉网带上，而后放置发泡陶瓷垫板，该发泡陶瓷不与铜和铜的氧化物反应；而后依次将铜片、瓷片、铜片叠放在发泡陶瓷垫板上进行烧结，烧结完毕后，将双面覆铜陶瓷基板取下。本发明利用发泡陶瓷作为烧结垫板材料，其在键合温度区间不与铜片反应，解决烧结垫片与铜片粘连、残留烧结印记的问题。与实心陶瓷垫板材料相比，发泡陶瓷导热系数低，一定程度上抑制了下层铜片晶粒偏大的情况。此外，发泡陶瓷与铜片实际接触面积大大减小，有效降低垫板材料对铜片的损伤。且发泡陶瓷热震性好，可循环使用，此外操作简单，对产品无污染，可提高DCB生产效率与生产质量。
Method for simultaneously sintering two surfaces of copper-clad ceramic substrate
The invention provides a method for simultaneously sintering double surfaces of a copper-clad ceramic substrate, which comprises the following steps of: firstly, placing a matrix gasket on a mesh belt of a sintering furnace, and then, placing a foamed ceramic base plate which does not react with copper and copper oxide; and then the copper sheet, the ceramic sheet and the copper sheet are sequentially stacked on the foamed ceramic base plate for sintering, and after sintering is completed, the double-sided copper-clad ceramic substrate is taken down. The foamed ceramic is used as a sintered base plate material and does not react with the copper sheet in a bonding temperature interval, so that the problems of adhesion of the sintered base plate and the copper sheet and residual sintering marks are solved. Compared with a solid ceramic base plate material, the foamed ceramic is low in heat conductivity coefficient, and the situation that crystal grains of a lower copper sheet are too large is restrained to a certain extent. In addition, the actual contact area of the foaming ceramic and the copper sheet is greatly reduced, and damage of the base plate material to the copper sheet is effectively reduced. The foaming ceramic has good thermal shock resistance, can be recycled, is simple to operate, has no pollution to the product, and can improve the production efficiency and production quality of DCB.
本发明提供覆铜陶瓷基板双面同时烧结方法，先将基体垫片放置于烧结炉网带上，而后放置发泡陶瓷垫板，该发泡陶瓷不与铜和铜的氧化物反应；而后依次将铜片、瓷片、铜片叠放在发泡陶瓷垫板上进行烧结，烧结完毕后，将双面覆铜陶瓷基板取下。本发明利用发泡陶瓷作为烧结垫板材料，其在键合温度区间不与铜片反应，解决烧结垫片与铜片粘连、残留烧结印记的问题。与实心陶瓷垫板材料相比，发泡陶瓷导热系数低，一定程度上抑制了下层铜片晶粒偏大的情况。此外，发泡陶瓷与铜片实际接触面积大大减小，有效降低垫板材料对铜片的损伤。且发泡陶瓷热震性好，可循环使用，此外操作简单，对产品无污染，可提高DCB生产效率与生产质量。
Method for simultaneously sintering two surfaces of copper-clad ceramic substrate
覆铜陶瓷基板双面同时烧结方法
DU TAO (author) / HE XIANHAN (author) / ZHU LIN (author) / YANG QIANGJUN (author)
2022-07-15
Patent
Electronic Resource
Chinese
Method for simultaneously sintering two layers of copper-clad ceramic substrate
| European Patent Office | 2023
| European Patent Office | 2024
| European Patent Office | 2023