A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Precision electronic device mold manufacturing method
The invention discloses a method for manufacturing a precision electronic device mold. Comprising the following steps: S1, preparing mold raw materials, wherein the mold raw materials comprise the following components in parts by weight: 50-100 parts of aluminum oxide, 3-6 parts of diatomite, 4-6 parts of montmorillonite, 4-6 parts of silicon dioxide, 40-60 parts of organic resin, 2-4 parts of a curing agent, 2-4 parts of an organic dispersant, 3-5 parts of a plasticizer and 3-5 parts of a surfactant; s2, mixing the raw materials; s3, raw material smelting; s4, preparing a blank; s5, processing the blank; s6, primary mold sintering; s7, quenching and tempering; s8, preparing a finished product mold; s9, pretreating a finished product mold; and S10, spraying a finished product mold. The aluminum oxide, the kieselguhr, the montmorillonite, the silicon dioxide, the organic resin, the curing agent, the organic dispersing agent, the plasticizer and the surface active agent are used as manufacturing materials of the mold, so that the manufactured mold has the characteristics of high temperature resistance, wear resistance and corrosion resistance, and the weight of the mold is reduced while the strength and the rigidity are met; and the service life of the die is prolonged.
本发明公开了一种精密电子器件模具制造方法，包括以下步骤：S1.准备模具原料：所述模具原料包括以下重量份计组分组成：氧化铝50‑100份、硅藻土3‑6份、蒙脱土4‑6份、二氧化硅4‑6份、有机树脂40‑60份、固化剂2‑4份、有机分散剂2‑4份、增塑剂3‑5份和表面活性剂3‑5份；S2.原料混合；S3.原料熔炼；S4.制备毛坯；S5.毛坯加工；S6.初级模具烧结；S7.淬火和回火；S8.制备成品模具；S9.成品模具预处理；S10.成品模具喷涂。本发明通过采用氧化铝、硅藻土、蒙脱土、二氧化硅、有机树脂、固化剂、有机分散剂、增塑剂和表面活性剂作为模具的制作材料，使得制得的模具有耐高温、耐磨损、耐腐蚀的特点，在满足强度和刚度的同时降低了模具的重量，有利于增加模具的使用寿命。
Precision electronic device mold manufacturing method
The invention discloses a method for manufacturing a precision electronic device mold. Comprising the following steps: S1, preparing mold raw materials, wherein the mold raw materials comprise the following components in parts by weight: 50-100 parts of aluminum oxide, 3-6 parts of diatomite, 4-6 parts of montmorillonite, 4-6 parts of silicon dioxide, 40-60 parts of organic resin, 2-4 parts of a curing agent, 2-4 parts of an organic dispersant, 3-5 parts of a plasticizer and 3-5 parts of a surfactant; s2, mixing the raw materials; s3, raw material smelting; s4, preparing a blank; s5, processing the blank; s6, primary mold sintering; s7, quenching and tempering; s8, preparing a finished product mold; s9, pretreating a finished product mold; and S10, spraying a finished product mold. The aluminum oxide, the kieselguhr, the montmorillonite, the silicon dioxide, the organic resin, the curing agent, the organic dispersing agent, the plasticizer and the surface active agent are used as manufacturing materials of the mold, so that the manufactured mold has the characteristics of high temperature resistance, wear resistance and corrosion resistance, and the weight of the mold is reduced while the strength and the rigidity are met; and the service life of the die is prolonged.
本发明公开了一种精密电子器件模具制造方法，包括以下步骤：S1.准备模具原料：所述模具原料包括以下重量份计组分组成：氧化铝50‑100份、硅藻土3‑6份、蒙脱土4‑6份、二氧化硅4‑6份、有机树脂40‑60份、固化剂2‑4份、有机分散剂2‑4份、增塑剂3‑5份和表面活性剂3‑5份；S2.原料混合；S3.原料熔炼；S4.制备毛坯；S5.毛坯加工；S6.初级模具烧结；S7.淬火和回火；S8.制备成品模具；S9.成品模具预处理；S10.成品模具喷涂。本发明通过采用氧化铝、硅藻土、蒙脱土、二氧化硅、有机树脂、固化剂、有机分散剂、增塑剂和表面活性剂作为模具的制作材料，使得制得的模具有耐高温、耐磨损、耐腐蚀的特点，在满足强度和刚度的同时降低了模具的重量，有利于增加模具的使用寿命。
Precision electronic device mold manufacturing method
一种精密电子器件模具制造方法
REN DAOYUAN (author) / LI ZHIFA (author) / SUN QIANG (author) / LIU XUESHENG (author)
2022-10-18
Patent
Electronic Resource
Chinese
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