A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Joined body, holding device, and electrostatic chuck
In the bonded body, the bonding layer is provided with: a bonding material having, as the main component, a metal having a surface tension at the melting point of 1,000 mN/m or less; and a metal layer in which a plurality of holes are formed, the bonding material entering at least a portion of the holes.
在接合体中，接合层具备：接合材料，其以熔点时的表面张力为1000mN/m以下的金属为主要成分；以及金属层，在该金属层形成有多个孔，接合材料进入到孔的至少一部分。
Joined body, holding device, and electrostatic chuck
In the bonded body, the bonding layer is provided with: a bonding material having, as the main component, a metal having a surface tension at the melting point of 1,000 mN/m or less; and a metal layer in which a plurality of holes are formed, the bonding material entering at least a portion of the holes.
在接合体中，接合层具备：接合材料，其以熔点时的表面张力为1000mN/m以下的金属为主要成分；以及金属层，在该金属层形成有多个孔，接合材料进入到孔的至少一部分。
Joined body, holding device, and electrostatic chuck
接合体、保持装置以及静电卡盘
YOSHIMOTO OSAMU (author) / ARAKAWA RYUICHI (author) / TANAKA TOMOO (author)
2022-10-18
Patent
Electronic Resource
Chinese