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Process for metalized nickel-gold electroplating of aluminum nitride ceramic chip
The invention discloses a process for metalizing and electroplating nickel and gold on an aluminum nitride ceramic chip. Step 2, polishing the surface; step 3, oil removal and cleaning; step 4; washing with water; step 5; step 6, sputtering a TiCu metal layer; step 7, carrying out micro-etching treatment; step 8, carrying out sand blasting treatment; step 9, carrying out spin coating, developing and exposing; step 10, solidifying glue; step 11, electroplating nickel and gold; step 12, removing the photoresist; step 13, etching; performing cutting; step 14; in the implementation process of the method, the steps are simple, operation is convenient, the plating effect is good, and the problems that in a traditional implementation mode, due to the fact that the surface roughness is too low, adhesion is poor after a pattern is photoetched through a dry film after a titanium-copper metal layer is sputtered, the temperature is too high during nickel-gold electroplating, and consequently short circuit is caused are solved; and the production quality and the surface metallization nickel-gold electroplating effect of the aluminum nitride ceramic wafer (polished wafer) are improved.
本发明公开了一种用于氮化铝陶瓷片金属化电镀镍金的工艺，包括步骤一；表面打磨：步骤二；除油清洁：步骤三；步骤四；水洗；步骤五；溅射TiCu金属层：步骤六；微蚀处理：步骤七；喷砂处理：步骤八；匀胶显影曝光：步骤九；固胶：步骤十；电镀镍金：步骤十一；去胶：步骤十二；蚀刻：步骤十三；切割；步骤十四；检查，本方法在实施过程中，步骤简单，操作方便，镀层效果好，避免传统实施方式中因为表面粗糙度太低造成，溅射完钛铜金属层后用干膜光刻出图形后附着力不良，电镀镍金时温度过高干膜脱落，从而造成短路的问题，提高氮化铝陶瓷片(抛光片)的生产质量和表面金属化电镀镍金效果。
Process for metalized nickel-gold electroplating of aluminum nitride ceramic chip
The invention discloses a process for metalizing and electroplating nickel and gold on an aluminum nitride ceramic chip. Step 2, polishing the surface; step 3, oil removal and cleaning; step 4; washing with water; step 5; step 6, sputtering a TiCu metal layer; step 7, carrying out micro-etching treatment; step 8, carrying out sand blasting treatment; step 9, carrying out spin coating, developing and exposing; step 10, solidifying glue; step 11, electroplating nickel and gold; step 12, removing the photoresist; step 13, etching; performing cutting; step 14; in the implementation process of the method, the steps are simple, operation is convenient, the plating effect is good, and the problems that in a traditional implementation mode, due to the fact that the surface roughness is too low, adhesion is poor after a pattern is photoetched through a dry film after a titanium-copper metal layer is sputtered, the temperature is too high during nickel-gold electroplating, and consequently short circuit is caused are solved; and the production quality and the surface metallization nickel-gold electroplating effect of the aluminum nitride ceramic wafer (polished wafer) are improved.
本发明公开了一种用于氮化铝陶瓷片金属化电镀镍金的工艺，包括步骤一；表面打磨：步骤二；除油清洁：步骤三；步骤四；水洗；步骤五；溅射TiCu金属层：步骤六；微蚀处理：步骤七；喷砂处理：步骤八；匀胶显影曝光：步骤九；固胶：步骤十；电镀镍金：步骤十一；去胶：步骤十二；蚀刻：步骤十三；切割；步骤十四；检查，本方法在实施过程中，步骤简单，操作方便，镀层效果好，避免传统实施方式中因为表面粗糙度太低造成，溅射完钛铜金属层后用干膜光刻出图形后附着力不良，电镀镍金时温度过高干膜脱落，从而造成短路的问题，提高氮化铝陶瓷片(抛光片)的生产质量和表面金属化电镀镍金效果。
Process for metalized nickel-gold electroplating of aluminum nitride ceramic chip
一种用于氮化铝陶瓷片金属化电镀镍金的工艺
ZHANG XIAO (author) / ZHU JIE (author)
2022-12-02
Patent
Electronic Resource
Chinese
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