A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
The invention discloses a ceramic packaging base and a preparation method thereof, and belongs to the technical field of materials for electronic components, and the ceramic packaging base comprises the following components in percentage by mass: 90-95% of Al2O3, 2-3% of SiO2, 1-3% of MnO2 and 0.1-0.5% of MgO. The Al2O3 comprises a first Al2O3 crystal grain with the particle size of 0.1 mu m-1 mu m and a second Al2O3 crystal grain with the particle size of 2.0 mu m-4. 0 mu m, and the mass ratio of the first Al2O3 crystal grain to the second Al2O3 crystal grain is (1-9): 1. The number of grain boundaries in the ceramic can be effectively increased through the first Al2O3 crystal grains with the grain size of 0.1-1 mu m and the second Al2O3 crystal grains with the grain size of 2.0-4.0 mu m, and microcrack propagation is effectively hindered, so that the density of the ceramic packaging base is effectively improved.
本发明公开了一种陶瓷封装基座及其制备方法，属于电子元器件用材料技术领域，所述的陶瓷封装基座，包括以下质量百分比的组分：90～95％Al2O3、2～3％SiO2、1～3％MnO2、0.1～0.5％MgO；所述Al2O3包括粒径为0.1um～1um的第一Al2O3晶粒、粒径为2.0um～4.0um的第二Al2O3晶粒，且所述第一Al2O3晶粒与第二Al2O3晶粒的质量比为(1～9)：1。通过以粒径为0.1um～1um的第一Al2O3晶粒、粒径为2.0um～4.0um的第二Al2O3晶粒，能够有效的增加陶瓷中晶界的数量，有效阻碍微裂纹扩展，从而有效的提高陶瓷封装基座的致密度。
The invention discloses a ceramic packaging base and a preparation method thereof, and belongs to the technical field of materials for electronic components, and the ceramic packaging base comprises the following components in percentage by mass: 90-95% of Al2O3, 2-3% of SiO2, 1-3% of MnO2 and 0.1-0.5% of MgO. The Al2O3 comprises a first Al2O3 crystal grain with the particle size of 0.1 mu m-1 mu m and a second Al2O3 crystal grain with the particle size of 2.0 mu m-4. 0 mu m, and the mass ratio of the first Al2O3 crystal grain to the second Al2O3 crystal grain is (1-9): 1. The number of grain boundaries in the ceramic can be effectively increased through the first Al2O3 crystal grains with the grain size of 0.1-1 mu m and the second Al2O3 crystal grains with the grain size of 2.0-4.0 mu m, and microcrack propagation is effectively hindered, so that the density of the ceramic packaging base is effectively improved.
本发明公开了一种陶瓷封装基座及其制备方法，属于电子元器件用材料技术领域，所述的陶瓷封装基座，包括以下质量百分比的组分：90～95％Al2O3、2～3％SiO2、1～3％MnO2、0.1～0.5％MgO；所述Al2O3包括粒径为0.1um～1um的第一Al2O3晶粒、粒径为2.0um～4.0um的第二Al2O3晶粒，且所述第一Al2O3晶粒与第二Al2O3晶粒的质量比为(1～9)：1。通过以粒径为0.1um～1um的第一Al2O3晶粒、粒径为2.0um～4.0um的第二Al2O3晶粒，能够有效的增加陶瓷中晶界的数量，有效阻碍微裂纹扩展，从而有效的提高陶瓷封装基座的致密度。
Ceramic packaging base and preparation method thereof
一种陶瓷封装基座及其制备方法
2022-12-06
Patent
Electronic Resource
Chinese
Ceramic metal packaging shell, preparation method and application thereof
| European Patent Office | 2023