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Sealing door and semiconductor device
The invention relates to the technical field of semiconductors, and particularly discloses a sealing door and semiconductor equipment, and the sealing door comprises a door body, a door frame, a U-shaped body and a gas channel. The door frame is connected with the door body in a matched mode and provided with an annular groove with an opening facing the door body. The U-shaped body is arranged in the annular groove, an opening of the U-shaped body faces the bottom of the annular groove, and a pressure space is formed between the U-shaped body and the annular groove; the gas channel is communicated with the pressure space, and when positive pressure is applied into the pressure space through the gas channel, the U-shaped body moves towards the door body to be in sealed contact with the door body, so that a passage between the door body and the door frame is blocked, and the sealing performance of the cavity is guaranteed; when negative pressure is applied to the pressure space through the gas channel, the U-shaped body moves away from the door body to reset, the gap between the door body and the door frame is released, unsealing is achieved, sealing can be achieved only by pressurizing the pressure space, the U-shaped body can reset by decompressing the pressure space, unsealing is achieved, operation is easy, and universality is high.
本申请涉及半导体技术领域，具体公开一种密封门及半导体设备，密封门包括门体、门框、U型体及气体通道。门框与门体配合连接，门框具有开口朝向门体的环形沟槽；U型体设置于环形沟槽内，U型体的开口朝向环形沟槽的底部，U型体与环形沟槽之间形成一压力空间；气体通道连通压力空间，经气体通道向压力空间内施加正压时，U型体朝向门体移动以与门体密封接触，进而阻断门体与门框之间的通路，保证腔体的密封性；当经气体通道向压力空间内施加负压，U型体远离门体移动以复位，门体与门框之间的间隙得以释放，实现解封，由此只需对压力空间内加压即可实现密封，对压力空间内减压，U型体即可复位，进而实现解封，操作简单且通用性高。
Sealing door and semiconductor device
The invention relates to the technical field of semiconductors, and particularly discloses a sealing door and semiconductor equipment, and the sealing door comprises a door body, a door frame, a U-shaped body and a gas channel. The door frame is connected with the door body in a matched mode and provided with an annular groove with an opening facing the door body. The U-shaped body is arranged in the annular groove, an opening of the U-shaped body faces the bottom of the annular groove, and a pressure space is formed between the U-shaped body and the annular groove; the gas channel is communicated with the pressure space, and when positive pressure is applied into the pressure space through the gas channel, the U-shaped body moves towards the door body to be in sealed contact with the door body, so that a passage between the door body and the door frame is blocked, and the sealing performance of the cavity is guaranteed; when negative pressure is applied to the pressure space through the gas channel, the U-shaped body moves away from the door body to reset, the gap between the door body and the door frame is released, unsealing is achieved, sealing can be achieved only by pressurizing the pressure space, the U-shaped body can reset by decompressing the pressure space, unsealing is achieved, operation is easy, and universality is high.
本申请涉及半导体技术领域，具体公开一种密封门及半导体设备，密封门包括门体、门框、U型体及气体通道。门框与门体配合连接，门框具有开口朝向门体的环形沟槽；U型体设置于环形沟槽内，U型体的开口朝向环形沟槽的底部，U型体与环形沟槽之间形成一压力空间；气体通道连通压力空间，经气体通道向压力空间内施加正压时，U型体朝向门体移动以与门体密封接触，进而阻断门体与门框之间的通路，保证腔体的密封性；当经气体通道向压力空间内施加负压，U型体远离门体移动以复位，门体与门框之间的间隙得以释放，实现解封，由此只需对压力空间内加压即可实现密封，对压力空间内减压，U型体即可复位，进而实现解封，操作简单且通用性高。
Sealing door and semiconductor device
密封门及半导体设备
ZHANG JINGNAN (author) / WU BIQIN (author) / PENG JUNSHENG (author) / WAN HANG (author)
2023-03-07
Patent
Electronic Resource
Chinese
IPC:
E06B
Feste oder bewegliche Abschlüsse für Öffnungen in Bauwerken, Fahrzeugen, Zäunen oder ähnlichen Einfriedungen allgemein, z.B. Türen, Fenster, Läden, Tore
,
FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES, OR LIKE ENCLOSURES, IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
Sealing door device for semiconductor equipment vacuum cavity
| European Patent Office | 2021