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A platform for research: civil engineering, architecture and urbanism
Ceramic copper-clad plate and preparation method thereof
The invention provides a preparation method of a ceramic copper-clad plate, which comprises the following steps: a copper foil and a ceramic substrate are provided, and the copper foil is patterned; the copper foil serves as a cathode and is placed in electroplating liquid for electrochemical deposition, a cuprous oxide layer is deposited on the surface of the copper foil, the electroplating liquid is ionic liquid, and copper ions serving as electrolyte are contained in the ionic liquid. And placing the copper foil on which the cuprous oxide layer is deposited at a preset position of the ceramic substrate for co-sintering. A cuprous oxide layer is only deposited on the surface of one side of the copper foil, and the side, deposited with the cuprous oxide layer, of the copper foil is used as a bonding surface of the copper foil and the ceramic substrate. The invention also provides the ceramic copper-clad plate prepared by the preparation method. The ceramic copper-clad plate prepared by the preparation method of the ceramic copper-clad plate provided by the invention is high in metal circuit precision, the copper layer and the ceramic substrate are firmly combined, and the copper layer is flat and does not blister.
本发明提供一种陶瓷覆铜板的制备方法，包括以下步骤：提供铜箔和陶瓷基板，其中，所述铜箔已图形化。将所述铜箔作为阴极置于电镀液中进行电化学沉积，使所述铜箔的表面沉积氧化亚铜层，其中，所述电镀液为离子液体，离子液体中含有作为电解质的铜离子。将沉积了氧化亚铜层的铜箔置于所述陶瓷基板的预设位置上共同烧结。仅在所述铜箔的一侧表面沉积氧化亚铜层，所述铜箔沉积有所述氧化亚铜层的一侧作为所述铜箔与所述陶瓷基板的结合面。还提供一种由上述制备方法制备的陶瓷覆铜板。本发明提供的陶瓷覆铜板的制备方法制备的陶瓷覆铜板的金属线路精度高、铜层与陶瓷基板结合牢固、铜层平整、不起泡。
Ceramic copper-clad plate and preparation method thereof
The invention provides a preparation method of a ceramic copper-clad plate, which comprises the following steps: a copper foil and a ceramic substrate are provided, and the copper foil is patterned; the copper foil serves as a cathode and is placed in electroplating liquid for electrochemical deposition, a cuprous oxide layer is deposited on the surface of the copper foil, the electroplating liquid is ionic liquid, and copper ions serving as electrolyte are contained in the ionic liquid. And placing the copper foil on which the cuprous oxide layer is deposited at a preset position of the ceramic substrate for co-sintering. A cuprous oxide layer is only deposited on the surface of one side of the copper foil, and the side, deposited with the cuprous oxide layer, of the copper foil is used as a bonding surface of the copper foil and the ceramic substrate. The invention also provides the ceramic copper-clad plate prepared by the preparation method. The ceramic copper-clad plate prepared by the preparation method of the ceramic copper-clad plate provided by the invention is high in metal circuit precision, the copper layer and the ceramic substrate are firmly combined, and the copper layer is flat and does not blister.
本发明提供一种陶瓷覆铜板的制备方法，包括以下步骤：提供铜箔和陶瓷基板，其中，所述铜箔已图形化。将所述铜箔作为阴极置于电镀液中进行电化学沉积，使所述铜箔的表面沉积氧化亚铜层，其中，所述电镀液为离子液体，离子液体中含有作为电解质的铜离子。将沉积了氧化亚铜层的铜箔置于所述陶瓷基板的预设位置上共同烧结。仅在所述铜箔的一侧表面沉积氧化亚铜层，所述铜箔沉积有所述氧化亚铜层的一侧作为所述铜箔与所述陶瓷基板的结合面。还提供一种由上述制备方法制备的陶瓷覆铜板。本发明提供的陶瓷覆铜板的制备方法制备的陶瓷覆铜板的金属线路精度高、铜层与陶瓷基板结合牢固、铜层平整、不起泡。
Ceramic copper-clad plate and preparation method thereof
陶瓷覆铜板及其制备方法
LI CHENGFENG (author) / YU MINGXIAN (author) / XIANG MING (author) / DAI GAOHUAN (author) / LIU JIANGUO (author)
2023-05-30
Patent
Electronic Resource
Chinese
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