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High temperature co-fired ceramic (HTCC) material with low thermal expansion coefficient and preparation method thereof
The invention relates to the technical field of electronic materials, and discloses a low-thermal-expansion-coefficient high-temperature co-fired ceramic (HTCC) material, which is prepared from the following raw materials in parts by weight: 70 to 90 percent of micron-sized aluminum oxide, 1 to 20 percent of submicron-sized aluminum oxide, 3 to 5 percent of cordierite, 3 to 5 percent of beta-eucryptite, 1 to 3 percent of chromium sesquioxide, 1 to 3 percent of molybdenum trioxide, 0.1 to 1 percent of yttrium oxide and a plurality of tape casting auxiliaries, the invention relates to a preparation method of a high temperature co-fired ceramic (HTCC) material with a low thermal expansion coefficient. The preparation method comprises the following working steps: S1, obtaining raw materials; s2, mixing the raw materials; and S3, sintering to be dense. According to the invention, cordierite, beta-eucryptite and submicron alumina are introduced to reduce the porosity of the ceramic material, so that the thermal expansion coefficient of the ceramic material is reduced, and the density, thermal conductivity and bending strength of the ceramic material are improved, thereby achieving the effect of improving the thermal shock resistance of the ceramic material.
本发明涉及电子材料技术领域，且公开了一种低热膨胀系数高温共烧陶瓷(HTCC)材料，包括以下重量份原料：微米级氧化铝：70％～90％、亚微米级氧化铝：1％～20％、堇青石：3％～5％、β‑锂霞石：3％～5％、三氧化二铬1％～3％、三氧化钼1％～3％、氧化钇0.1％～1％，流延助剂若干，一种低热膨胀系数高温共烧陶瓷(HTCC)材料的制备方法，包括以下工作步骤：S1：原料获取；S2：原料混合；S3：烧结成密。本发明中，通过堇青石、β‑锂霞石的引入，同时引入亚微米级氧化铝来降低陶瓷材料的孔隙率，可在降低陶瓷材料热膨胀系数的同时，提高陶瓷材料的致密度、热导率以及抗弯强度，从而达到了提高陶瓷材料的抗热震性能的效果。
High temperature co-fired ceramic (HTCC) material with low thermal expansion coefficient and preparation method thereof
The invention relates to the technical field of electronic materials, and discloses a low-thermal-expansion-coefficient high-temperature co-fired ceramic (HTCC) material, which is prepared from the following raw materials in parts by weight: 70 to 90 percent of micron-sized aluminum oxide, 1 to 20 percent of submicron-sized aluminum oxide, 3 to 5 percent of cordierite, 3 to 5 percent of beta-eucryptite, 1 to 3 percent of chromium sesquioxide, 1 to 3 percent of molybdenum trioxide, 0.1 to 1 percent of yttrium oxide and a plurality of tape casting auxiliaries, the invention relates to a preparation method of a high temperature co-fired ceramic (HTCC) material with a low thermal expansion coefficient. The preparation method comprises the following working steps: S1, obtaining raw materials; s2, mixing the raw materials; and S3, sintering to be dense. According to the invention, cordierite, beta-eucryptite and submicron alumina are introduced to reduce the porosity of the ceramic material, so that the thermal expansion coefficient of the ceramic material is reduced, and the density, thermal conductivity and bending strength of the ceramic material are improved, thereby achieving the effect of improving the thermal shock resistance of the ceramic material.
本发明涉及电子材料技术领域，且公开了一种低热膨胀系数高温共烧陶瓷(HTCC)材料，包括以下重量份原料：微米级氧化铝：70％～90％、亚微米级氧化铝：1％～20％、堇青石：3％～5％、β‑锂霞石：3％～5％、三氧化二铬1％～3％、三氧化钼1％～3％、氧化钇0.1％～1％，流延助剂若干，一种低热膨胀系数高温共烧陶瓷(HTCC)材料的制备方法，包括以下工作步骤：S1：原料获取；S2：原料混合；S3：烧结成密。本发明中，通过堇青石、β‑锂霞石的引入，同时引入亚微米级氧化铝来降低陶瓷材料的孔隙率，可在降低陶瓷材料热膨胀系数的同时，提高陶瓷材料的致密度、热导率以及抗弯强度，从而达到了提高陶瓷材料的抗热震性能的效果。
High temperature co-fired ceramic (HTCC) material with low thermal expansion coefficient and preparation method thereof
一种低热膨胀系数高温共烧陶瓷（HTCC）材料及其制备方法
JI JIANCHAO (author) / CHENG SHUMIN (author) / ZHANG YUEYUE (author) / LU JINGQI (author) / LIU AIRU (author) / BAI XINGXING (author) / PANG CHAO (author)
2023-06-27
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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