A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Multilayer ceramic shell and preparation method thereof
The invention is suitable for the technical field of electronic packaging, and provides a multilayer ceramic shell and a preparation method thereof.The method comprises the steps that functional ceramic is stacked on a ceramic substrate, and the portion between the functional ceramic and the ceramic substrate is coated with a binder; manufacturing a cavity with a preset size on the functional ceramic, wherein the cavity is used for arranging a chip; a ceramic co-fired sealing ring is placed on the functional ceramic, the portion between the functional ceramic and the ceramic co-fired sealing ring is coated with a binder, and the ceramic co-fired sealing ring is arranged over the cavity; and performing high-pressure compaction and high-temperature sintering operation on the ceramic co-fired sealing ring, the functional ceramic and the ceramic substrate to obtain the multi-layer ceramic shell. The air tightness of the ceramic shell can be improved.
本申请适用于电子封装技术领域，提供了多层陶瓷外壳及其制备方法，该方法包括：将功能陶瓷叠放置在陶瓷基底上，其中，功能陶瓷和陶瓷基底之间涂覆有粘结剂；在功能陶瓷上制作预设大小的腔体，腔体用于布置芯片；将陶瓷共烧封口环放置在功能陶瓷上，其中，功能陶瓷和陶瓷共烧封口环之间涂覆有粘结剂，陶瓷共烧封口环设置于腔体正上方；对陶瓷共烧封口环、功能陶瓷和陶瓷衬底进行高压压实和高温烧结操作，得到多层陶瓷外壳。本申请可以提高陶瓷外壳的气密性。
Multilayer ceramic shell and preparation method thereof
The invention is suitable for the technical field of electronic packaging, and provides a multilayer ceramic shell and a preparation method thereof.The method comprises the steps that functional ceramic is stacked on a ceramic substrate, and the portion between the functional ceramic and the ceramic substrate is coated with a binder; manufacturing a cavity with a preset size on the functional ceramic, wherein the cavity is used for arranging a chip; a ceramic co-fired sealing ring is placed on the functional ceramic, the portion between the functional ceramic and the ceramic co-fired sealing ring is coated with a binder, and the ceramic co-fired sealing ring is arranged over the cavity; and performing high-pressure compaction and high-temperature sintering operation on the ceramic co-fired sealing ring, the functional ceramic and the ceramic substrate to obtain the multi-layer ceramic shell. The air tightness of the ceramic shell can be improved.
本申请适用于电子封装技术领域，提供了多层陶瓷外壳及其制备方法，该方法包括：将功能陶瓷叠放置在陶瓷基底上，其中，功能陶瓷和陶瓷基底之间涂覆有粘结剂；在功能陶瓷上制作预设大小的腔体，腔体用于布置芯片；将陶瓷共烧封口环放置在功能陶瓷上，其中，功能陶瓷和陶瓷共烧封口环之间涂覆有粘结剂，陶瓷共烧封口环设置于腔体正上方；对陶瓷共烧封口环、功能陶瓷和陶瓷衬底进行高压压实和高温烧结操作，得到多层陶瓷外壳。本申请可以提高陶瓷外壳的气密性。
Multilayer ceramic shell and preparation method thereof
多层陶瓷外壳及其制备方法
2023-08-22
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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