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Large-size and high-strength ceramic substrate and preparation method thereof
The invention relates to the technical field of ceramic substrates, in particular to a large-size and high-strength ceramic substrate and a preparation method thereof. The preparation method comprises the following steps: carrying out tape casting on the prepared slurry, punching and molding, and sintering; wherein the slurry raw materials comprise a solid phase component, a binder, a plasticizer, a dispersant and a solvent, the solid phase component comprises 96-99% by mass of alumina powder and 1-4% by mass of a cosolvent, and the particle size of the alumina powder is 1.0-3.5 [mu] m; the sintering temperature ranges from 1500 DEG C to 1650 DEG C. By reducing the particle size of aluminum oxide and changing the sintering temperature, the production efficiency of the large-specification ceramic substrate is ensured, so that the production efficiency of the chip resistor is improved by 27.3%-39.1%. Meanwhile, by adjusting the particle size of the alumina powder, the surface roughness of the product is reduced, and the warping qualification rate is increased.
本发明涉及陶瓷基板技术领域，具体涉及一种大尺寸、高强度陶瓷基板及其制备方法。制备方法为将配制好的浆料流延成型、冲模成型后烧结；其中，浆料原料包括固相组分、粘结剂、增塑剂、分散剂和溶剂，固相组分包括质量百分含量为96%‑99%的氧化铝粉和质量百分含量为1%‑4%的助溶剂，氧化铝粉的粒径为1.0‑3.5μm；烧结温度为1500‑1650℃。本发明通过减小氧化铝粒径，改变烧结温度，保证了大规格陶瓷基板的生产效率，从而使贴片电阻的生产效率提高27.3%‑39.1%。同时，通过调整氧化铝粉的粒径还降低了产品的表面粗糙度，提升了翘曲合格率。
Large-size and high-strength ceramic substrate and preparation method thereof
The invention relates to the technical field of ceramic substrates, in particular to a large-size and high-strength ceramic substrate and a preparation method thereof. The preparation method comprises the following steps: carrying out tape casting on the prepared slurry, punching and molding, and sintering; wherein the slurry raw materials comprise a solid phase component, a binder, a plasticizer, a dispersant and a solvent, the solid phase component comprises 96-99% by mass of alumina powder and 1-4% by mass of a cosolvent, and the particle size of the alumina powder is 1.0-3.5 [mu] m; the sintering temperature ranges from 1500 DEG C to 1650 DEG C. By reducing the particle size of aluminum oxide and changing the sintering temperature, the production efficiency of the large-specification ceramic substrate is ensured, so that the production efficiency of the chip resistor is improved by 27.3%-39.1%. Meanwhile, by adjusting the particle size of the alumina powder, the surface roughness of the product is reduced, and the warping qualification rate is increased.
本发明涉及陶瓷基板技术领域，具体涉及一种大尺寸、高强度陶瓷基板及其制备方法。制备方法为将配制好的浆料流延成型、冲模成型后烧结；其中，浆料原料包括固相组分、粘结剂、增塑剂、分散剂和溶剂，固相组分包括质量百分含量为96%‑99%的氧化铝粉和质量百分含量为1%‑4%的助溶剂，氧化铝粉的粒径为1.0‑3.5μm；烧结温度为1500‑1650℃。本发明通过减小氧化铝粒径，改变烧结温度，保证了大规格陶瓷基板的生产效率，从而使贴片电阻的生产效率提高27.3%‑39.1%。同时，通过调整氧化铝粉的粒径还降低了产品的表面粗糙度，提升了翘曲合格率。
Large-size and high-strength ceramic substrate and preparation method thereof
一种大尺寸、高强度陶瓷基板及其制备方法
LIU GUANGMING (author)
2024-01-19
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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