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Pore-filling slurry and pore-filling method for low-temperature co-fired ceramic system
The invention discloses a pore-filling slurry for a low-temperature co-fired ceramic system and a pore-filling method, the pore-filling slurry for the low-temperature co-fired ceramic system comprises gold powder, glass powder, an organic carrier, an additive and a surfactant; wherein when the softening temperature of the glass powder is not higher than 551 DEG C, the mass ratio of the gold powder to the glass powder is (29-88): 1; and when the softening temperature of the glass powder is not lower than 627 DEG C, the mass ratio of the gold powder to the glass powder is 29: 1. According to the invention, the hole filling problem of the low-temperature co-fired ceramic system is solved, and meanwhile, the low-temperature co-fired ceramic system after hole filling has the characteristics of smooth surface, less glass powder aggregation phenomenon and the like.
本发明公开了一种用于低温共烧陶瓷体系的填孔浆料及填孔方法，用于低温共烧陶瓷体系的填孔浆料，包括：金粉、玻璃粉、有机载体、添加剂和表面活性剂；其中，当玻璃粉的软化温度不高于551℃时，金粉与玻璃粉的质量比为(29～88)：1；当玻璃粉的软化温度不低于627℃时，金粉与玻璃粉的质量比为29：1。本发明解决了低温共烧陶瓷体系的填孔问题，同时，填孔后的低温共烧陶瓷体系，具有表面平整，玻璃粉聚集现象少等特点。
Pore-filling slurry and pore-filling method for low-temperature co-fired ceramic system
The invention discloses a pore-filling slurry for a low-temperature co-fired ceramic system and a pore-filling method, the pore-filling slurry for the low-temperature co-fired ceramic system comprises gold powder, glass powder, an organic carrier, an additive and a surfactant; wherein when the softening temperature of the glass powder is not higher than 551 DEG C, the mass ratio of the gold powder to the glass powder is (29-88): 1; and when the softening temperature of the glass powder is not lower than 627 DEG C, the mass ratio of the gold powder to the glass powder is 29: 1. According to the invention, the hole filling problem of the low-temperature co-fired ceramic system is solved, and meanwhile, the low-temperature co-fired ceramic system after hole filling has the characteristics of smooth surface, less glass powder aggregation phenomenon and the like.
本发明公开了一种用于低温共烧陶瓷体系的填孔浆料及填孔方法，用于低温共烧陶瓷体系的填孔浆料，包括：金粉、玻璃粉、有机载体、添加剂和表面活性剂；其中，当玻璃粉的软化温度不高于551℃时，金粉与玻璃粉的质量比为(29～88)：1；当玻璃粉的软化温度不低于627℃时，金粉与玻璃粉的质量比为29：1。本发明解决了低温共烧陶瓷体系的填孔问题，同时，填孔后的低温共烧陶瓷体系，具有表面平整，玻璃粉聚集现象少等特点。
Pore-filling slurry and pore-filling method for low-temperature co-fired ceramic system
一种用于低温共烧陶瓷体系的填孔浆料及填孔方法
SONG CHUL-WOO (author) / WU SHUANG (author) / YUAN JUNWU (author) / LI CONG (author) / SUN WENWU (author)
2024-02-20
Patent
Electronic Resource
Chinese
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