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Diamond/silicon carbide ceramic composite material and preparation method thereof
The invention belongs to the technical field of insulating substrate materials for electronic packaging, and discloses a diamond/silicon carbide ceramic composite material and a preparation method thereof.The preparation method comprises the following steps that diamond, silicon carbide, carbon powder and silicon powder are cleaned, dried and mixed to be uniform, and then the mixture is put into a mold; placing the die filled with the material into a sleeve, placing a silicon block on the material above the die, and placing a pressure head on the silicon block; and putting the sleeve into a sintering furnace, carrying out pressure sintering treatment in a nitrogen atmosphere, and after the mold is cooled to room temperature, demolding and removing redundant silicon to obtain the diamond/silicon carbide ceramic composite material. The diamond/silicon carbide ceramic composite material prepared by the preparation method has the advantages that the overall heat dissipation performance is good, the heat dissipation requirement of a chip can be met, the high-temperature time of the technological process is short, the diamond is not prone to graphitization, introduction of impurities is avoided, and the performance of the material is high.
本发明属于电子封装用绝缘基板材料技术领域，公开了一种金刚石/碳化硅陶瓷复合材料及其制备方法，包括以下步骤：将金刚石、碳化硅、炭粉、硅粉经清洗、烘干、混合均匀后，装入模具内；将上述装好材料的模具放入套筒内，并在模具上方的材料上放置硅块，硅块上放置有压头；将套筒放入烧结炉中，在氮气气氛中进行加压烧结处理，待模具冷却至室温后，脱模并去掉多余的硅，得到金刚石/碳化硅陶瓷复合材料。本发明制备方法制备得到的金刚石/碳化硅陶瓷复合材料具有整体散热性能好、能满足芯片的散热需求，工艺过程的高温时间短、金刚石不容易石墨化、避免了杂质的引入以及材料的性能高等优点。
Diamond/silicon carbide ceramic composite material and preparation method thereof
The invention belongs to the technical field of insulating substrate materials for electronic packaging, and discloses a diamond/silicon carbide ceramic composite material and a preparation method thereof.The preparation method comprises the following steps that diamond, silicon carbide, carbon powder and silicon powder are cleaned, dried and mixed to be uniform, and then the mixture is put into a mold; placing the die filled with the material into a sleeve, placing a silicon block on the material above the die, and placing a pressure head on the silicon block; and putting the sleeve into a sintering furnace, carrying out pressure sintering treatment in a nitrogen atmosphere, and after the mold is cooled to room temperature, demolding and removing redundant silicon to obtain the diamond/silicon carbide ceramic composite material. The diamond/silicon carbide ceramic composite material prepared by the preparation method has the advantages that the overall heat dissipation performance is good, the heat dissipation requirement of a chip can be met, the high-temperature time of the technological process is short, the diamond is not prone to graphitization, introduction of impurities is avoided, and the performance of the material is high.
本发明属于电子封装用绝缘基板材料技术领域，公开了一种金刚石/碳化硅陶瓷复合材料及其制备方法，包括以下步骤：将金刚石、碳化硅、炭粉、硅粉经清洗、烘干、混合均匀后，装入模具内；将上述装好材料的模具放入套筒内，并在模具上方的材料上放置硅块，硅块上放置有压头；将套筒放入烧结炉中，在氮气气氛中进行加压烧结处理，待模具冷却至室温后，脱模并去掉多余的硅，得到金刚石/碳化硅陶瓷复合材料。本发明制备方法制备得到的金刚石/碳化硅陶瓷复合材料具有整体散热性能好、能满足芯片的散热需求，工艺过程的高温时间短、金刚石不容易石墨化、避免了杂质的引入以及材料的性能高等优点。
Diamond/silicon carbide ceramic composite material and preparation method thereof
一种金刚石/碳化硅陶瓷复合材料及其制备方法
YAO HUAN (author) / WANG ZHENG (author) / ZHOU JUN (author) / ZHOU ENFEI (author) / KANG CHIWON (author) / ZHENG QIUBO (author)
2024-06-21
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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