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A platform for research: civil engineering, architecture and urbanism
Ceramic substrate and preparation method thereof
The invention provides a ceramic substrate and a preparation method thereof. The preparation method of the ceramic substrate comprises the following steps: respectively forming tungsten slurry layers on the front surface and the back surface of an aluminum nitride substrate; sintering the tungsten slurry layer to obtain a sintered tungsten layer; and sequentially arranging a nickel layer and a gold layer on the outer surface of the sintered tungsten layer to prepare the ceramic substrate, wherein the highest temperature of sintering treatment ranges from 1800 DEG C to 1900 DEG C, and the heat preservation time of the highest temperature ranges from 2 h to 4 h; the thickness of the gold layer is greater than or equal to 0.5 mu m; and the printing sintering layer comprises aluminum nitride with the volume percentage of 35 vol%-45 vol%. According to the preparation method, the highest temperature of sintering treatment is controlled within a specific range, and the binding force between the tungsten layer and the aluminum nitride substrate can be improved; by adjusting the volume percent of aluminum nitride in the tungsten slurry and the thickness of the gold layer, the color change condition of the ceramic substrate under the high-temperature condition can be effectively improved.
本申请提供了一种陶瓷基板及其制备方法。所述陶瓷基板的制备方法包括如下步骤：在氮化铝基板的正面和反面分别形成钨浆料层；对所述钨浆料层进行烧结处理，制得烧结钨层；以及在所述烧结钨层的外表面依次设置镍层和金层，制得陶瓷基板；其中，烧结处理的最高温度为1800℃~1900℃，所述最高温度的保温时间为2h~4h；所述金层的厚度≥0.5μm；所述印刷烧结层中包括体积百分比为35vol%~45vol%的氮化铝。本申请的制备方法，控制烧结处理的最高温度在特定范围内，能够提升钨层与氮化铝基板之间的结合力；通过调整钨浆中氮化铝的体积百分比和金层的厚度，能够有效地改善陶瓷基板在高温条件下变色的情况。
Ceramic substrate and preparation method thereof
The invention provides a ceramic substrate and a preparation method thereof. The preparation method of the ceramic substrate comprises the following steps: respectively forming tungsten slurry layers on the front surface and the back surface of an aluminum nitride substrate; sintering the tungsten slurry layer to obtain a sintered tungsten layer; and sequentially arranging a nickel layer and a gold layer on the outer surface of the sintered tungsten layer to prepare the ceramic substrate, wherein the highest temperature of sintering treatment ranges from 1800 DEG C to 1900 DEG C, and the heat preservation time of the highest temperature ranges from 2 h to 4 h; the thickness of the gold layer is greater than or equal to 0.5 mu m; and the printing sintering layer comprises aluminum nitride with the volume percentage of 35 vol%-45 vol%. According to the preparation method, the highest temperature of sintering treatment is controlled within a specific range, and the binding force between the tungsten layer and the aluminum nitride substrate can be improved; by adjusting the volume percent of aluminum nitride in the tungsten slurry and the thickness of the gold layer, the color change condition of the ceramic substrate under the high-temperature condition can be effectively improved.
本申请提供了一种陶瓷基板及其制备方法。所述陶瓷基板的制备方法包括如下步骤：在氮化铝基板的正面和反面分别形成钨浆料层；对所述钨浆料层进行烧结处理，制得烧结钨层；以及在所述烧结钨层的外表面依次设置镍层和金层，制得陶瓷基板；其中，烧结处理的最高温度为1800℃~1900℃，所述最高温度的保温时间为2h~4h；所述金层的厚度≥0.5μm；所述印刷烧结层中包括体积百分比为35vol%~45vol%的氮化铝。本申请的制备方法，控制烧结处理的最高温度在特定范围内，能够提升钨层与氮化铝基板之间的结合力；通过调整钨浆中氮化铝的体积百分比和金层的厚度，能够有效地改善陶瓷基板在高温条件下变色的情况。
Ceramic substrate and preparation method thereof
陶瓷基板及其制备方法
TAN YICHENG (author) / ZHU ZUOXIANG (author) / ZHOU JIANYANG (author) / FU RAN (author) / CAI QUN (author)
2024-07-16
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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