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Method for preparing silver-coated AlN ceramic substrate by hot pressed sintering of Ag powder
The invention relates to a method for preparing a silver-coated AlN ceramic substrate, in particular to a method for preparing a silver-coated AlN ceramic substrate through hot pressed sintering of Ag powder. The invention aims to solve the technical problems of complex process and high cost during the surface metallization of the AlN ceramic in the prior art. According to the method, the pure Ag powder is pressed into the Ag sheet, the protective layer is cushioned on the Ag sheet, then the Ag sheet is directly subjected to hot pressing sintering on the AlN ceramic in the air environment, the Ag and the AlN ceramic can react in the air to generate a layer of oxide, the connection strength between the Ag and the AlN is enhanced, and the purpose that the Ag is used for metallization on the surface of the ceramic is achieved. The obtained silver-coated AlN ceramic substrate has the advantages of high heat conductivity, low resistivity, good mechanical property, simple process, low cost and the like, can meet the requirements of industrial mass production and use, and can be widely applied to third-generation semiconductor electronic packaging.
一种热压烧结Ag粉制备覆银AlN陶瓷基板的方法，涉及一种制备覆银AlN陶瓷基板的方法。本发明是要解决现有的AlN陶瓷表面金属化时的工艺复杂，成本较高的技术问题。本发明通过将纯Ag粉压制成Ag片，再在Ag片上垫一层保护层，然后直接在空气环境下将Ag片热压烧结在AlN陶瓷上，在空气中Ag与AlN陶瓷之间会发生反应生成一层氧化物，增强Ag与AlN之间的连接强度，达到在陶瓷表面使用Ag进行金属化的目的。本发明获得的覆银AlN陶瓷基板具有热导率高、电阻率低、力学性能好、工艺简单和成本低等优点，可以满足工业化大批量制作与使用的要求，可以广泛应用于第三代半导体电子封装。
Method for preparing silver-coated AlN ceramic substrate by hot pressed sintering of Ag powder
The invention relates to a method for preparing a silver-coated AlN ceramic substrate, in particular to a method for preparing a silver-coated AlN ceramic substrate through hot pressed sintering of Ag powder. The invention aims to solve the technical problems of complex process and high cost during the surface metallization of the AlN ceramic in the prior art. According to the method, the pure Ag powder is pressed into the Ag sheet, the protective layer is cushioned on the Ag sheet, then the Ag sheet is directly subjected to hot pressing sintering on the AlN ceramic in the air environment, the Ag and the AlN ceramic can react in the air to generate a layer of oxide, the connection strength between the Ag and the AlN is enhanced, and the purpose that the Ag is used for metallization on the surface of the ceramic is achieved. The obtained silver-coated AlN ceramic substrate has the advantages of high heat conductivity, low resistivity, good mechanical property, simple process, low cost and the like, can meet the requirements of industrial mass production and use, and can be widely applied to third-generation semiconductor electronic packaging.
一种热压烧结Ag粉制备覆银AlN陶瓷基板的方法，涉及一种制备覆银AlN陶瓷基板的方法。本发明是要解决现有的AlN陶瓷表面金属化时的工艺复杂，成本较高的技术问题。本发明通过将纯Ag粉压制成Ag片，再在Ag片上垫一层保护层，然后直接在空气环境下将Ag片热压烧结在AlN陶瓷上，在空气中Ag与AlN陶瓷之间会发生反应生成一层氧化物，增强Ag与AlN之间的连接强度，达到在陶瓷表面使用Ag进行金属化的目的。本发明获得的覆银AlN陶瓷基板具有热导率高、电阻率低、力学性能好、工艺简单和成本低等优点，可以满足工业化大批量制作与使用的要求，可以广泛应用于第三代半导体电子封装。
Method for preparing silver-coated AlN ceramic substrate by hot pressed sintering of Ag powder
一种热压烧结Ag粉制备覆银AlN陶瓷基板的方法
LIU YANG (author) / DING ZHICHENG (author) / ZHANG CHENGHAO (author) / YANG LE (author) / WANG JUN (author) / JIANG XUENING (author) / ZHANG BO (author)
2024-09-03
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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