A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Heating layer structure of floor tile
The invention relates to the technical field of floor tiles, and discloses a heating layer structure of a floor tile, which comprises a buffer layer, a first flat gasket is fixedly arranged at the bottom end of the buffer layer, a heat conduction layer is fixedly arranged at the bottom end of the first flat gasket, and an elastic layer is fixedly arranged at the bottom end of the heat conduction layer. A second flat gasket is fixedly arranged at the bottom end of the elastic layer, and a clamping assembly extending to the position below the second flat gasket is arranged above the buffer layer. The clamping assembly comprises a clamping and buffering layer, a first flat gasket, a heat conduction layer, an elastic layer and a nail body in a second flat gasket, the top end of the nail body is fixedly connected with a round nail head, and the bottom end of the nail body is fixedly connected with a flat nail head. The heating layer structure of the floor tile has the advantages that the paving of each heating tile is similar to the structural assembly of a flooring plate, a heating electric system is well grounded, the safety and customer acceptance are improved, and the like.
本发明涉及地面瓷砖技术领域，且公开了一种地面瓷砖的发热层结构，包括缓冲层，所述缓冲层的底端固定设置有第一平垫片，所述第一平垫片的底端固定设置有导热层，所述导热层的底端固定设置有弹性层，所述弹性层的底端固定设置有第二平垫片，所述缓冲层的上方设置有延伸至第二平垫片下方的卡接组件；所述卡接组件包括卡接与缓冲层、第一平垫片、导热层、弹性层和第二平垫片内部的钉身，所述钉身的顶端固定连接有圆形钉头，所述钉身的底端固定连接有扁平钉头。该地面瓷砖的发热层结构，具备每块发热砖的铺贴类似地木板的结构拼装且发热电系统的良好接地、提高安全性和客户接受度等优点。
Heating layer structure of floor tile
The invention relates to the technical field of floor tiles, and discloses a heating layer structure of a floor tile, which comprises a buffer layer, a first flat gasket is fixedly arranged at the bottom end of the buffer layer, a heat conduction layer is fixedly arranged at the bottom end of the first flat gasket, and an elastic layer is fixedly arranged at the bottom end of the heat conduction layer. A second flat gasket is fixedly arranged at the bottom end of the elastic layer, and a clamping assembly extending to the position below the second flat gasket is arranged above the buffer layer. The clamping assembly comprises a clamping and buffering layer, a first flat gasket, a heat conduction layer, an elastic layer and a nail body in a second flat gasket, the top end of the nail body is fixedly connected with a round nail head, and the bottom end of the nail body is fixedly connected with a flat nail head. The heating layer structure of the floor tile has the advantages that the paving of each heating tile is similar to the structural assembly of a flooring plate, a heating electric system is well grounded, the safety and customer acceptance are improved, and the like.
本发明涉及地面瓷砖技术领域，且公开了一种地面瓷砖的发热层结构，包括缓冲层，所述缓冲层的底端固定设置有第一平垫片，所述第一平垫片的底端固定设置有导热层，所述导热层的底端固定设置有弹性层，所述弹性层的底端固定设置有第二平垫片，所述缓冲层的上方设置有延伸至第二平垫片下方的卡接组件；所述卡接组件包括卡接与缓冲层、第一平垫片、导热层、弹性层和第二平垫片内部的钉身，所述钉身的顶端固定连接有圆形钉头，所述钉身的底端固定连接有扁平钉头。该地面瓷砖的发热层结构，具备每块发热砖的铺贴类似地木板的结构拼装且发热电系统的良好接地、提高安全性和客户接受度等优点。
Heating layer structure of floor tile
一种地面瓷砖的发热层结构
WANG XIANGGANG (author) / XU CAIMING (author)
2024-10-22
Patent
Electronic Resource
Chinese
Floor heating tile with electric heating chip fired in tile body
| European Patent Office | 2020