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Process for improving high-temperature sintering warping of ceramic substrate
The invention provides a process for improving high-temperature sintering warpage of a ceramic substrate, which adopts a co-shrinkage soaring method for the first time, and is technically characterized in that before a substrate is sintered, a green body which is made of the same material as a sintered product and is slightly thicker than a green body of the sintered product is adopted as a cushion block to be respectively placed on the periphery of a green body of the substrate, and a cover plate covers the green body of the substrate; and finally sintering at high temperature. Due to the fact that the cushion blocks are shrunk with the same shrinking percentage as the product in the sintering process, the thickness of the surrounding cushion blocks is larger than that of the product all the time in the sintering process, the product can be located in a small limiting space all the time, and the warping problem generated in the sintering process of the ceramic substrate can be solved. The preparation process is simple and easy to implement, and has wide application prospects in the fields of electronic packaging and precision part manufacturing.
本发明提供了一种改善陶瓷基片高温烧结翘曲的工艺，本发明首次采用共收缩腾空法，其技术特点是在基板烧结前，采用与烧结产品同种材料，比烧结产品生胚厚度略大一点的生胚作为垫块分别放在基板生坯的四周，盖上盖板，最后高温烧结而成。由于垫块在烧结的过程中，和产品以相同的收缩率进行收缩，使得在烧结过程中，周围垫块的厚度始终比产品的厚度大，这可使得产品始终处于较小的限位空间中，从而可以解决了陶瓷基片在烧结中产生的翘曲问题。本发明制备工艺简单易行，在电子封装领域，精密零件制造领域具有广阔的应用前景。
Process for improving high-temperature sintering warping of ceramic substrate
The invention provides a process for improving high-temperature sintering warpage of a ceramic substrate, which adopts a co-shrinkage soaring method for the first time, and is technically characterized in that before a substrate is sintered, a green body which is made of the same material as a sintered product and is slightly thicker than a green body of the sintered product is adopted as a cushion block to be respectively placed on the periphery of a green body of the substrate, and a cover plate covers the green body of the substrate; and finally sintering at high temperature. Due to the fact that the cushion blocks are shrunk with the same shrinking percentage as the product in the sintering process, the thickness of the surrounding cushion blocks is larger than that of the product all the time in the sintering process, the product can be located in a small limiting space all the time, and the warping problem generated in the sintering process of the ceramic substrate can be solved. The preparation process is simple and easy to implement, and has wide application prospects in the fields of electronic packaging and precision part manufacturing.
本发明提供了一种改善陶瓷基片高温烧结翘曲的工艺，本发明首次采用共收缩腾空法，其技术特点是在基板烧结前，采用与烧结产品同种材料，比烧结产品生胚厚度略大一点的生胚作为垫块分别放在基板生坯的四周，盖上盖板，最后高温烧结而成。由于垫块在烧结的过程中，和产品以相同的收缩率进行收缩，使得在烧结过程中，周围垫块的厚度始终比产品的厚度大，这可使得产品始终处于较小的限位空间中，从而可以解决了陶瓷基片在烧结中产生的翘曲问题。本发明制备工艺简单易行，在电子封装领域，精密零件制造领域具有广阔的应用前景。
Process for improving high-temperature sintering warping of ceramic substrate
一种改善陶瓷基片高温烧结翘曲的工艺
ZHUO WEIZHUANG (author) / WEN WEIJIA (author)
2024-12-10
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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