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A platform for research: civil engineering, architecture and urbanism
Sintering process of ultrathin ceramic substrate
The invention provides a sintering process of an ultrathin ceramic substrate, which comprises the following steps: A) dispersing alumina powder, a sintering aid, a dispersing agent and a solvent by first-stage ball milling, and then adding a binder and a plasticizer by second-stage ball milling to obtain slurry; the sintering aid is prepared from SiO2, MgO and CaO; the mass of the sintering aid is 0.3-0.8% of the mass of the alumina powder; b) carrying out tape casting on the slurry to obtain a gasket green body; c) slicing the gasket green body, and sintering at 1500-1530 DEG C to obtain a gasket cooked piece; d, the gasket cooked piece and an ultra-thin ceramic green body are placed in a laminated mode and fired, and the ultra-thin ceramic substrate is obtained.By means of the method, the problems that pits, pits, bumps and the like appear on the surface of the ultra-thin ceramic substrate can be avoided, the gasket cooked piece can be recycled, and cost is saved.
本发明提供了一种超薄陶瓷基板的烧结工艺，包括以下步骤：A）将氧化铝粉、烧结助剂、分散剂和溶剂一段球磨分散，然后加入粘结剂和塑化剂二段球磨分散，得到浆料；所述烧结助剂包括SiO2、MgO和CaO；所述烧结助剂的质量为所述氧化铝粉质量的0.3~0.8%；B）将所述浆料流延成型，得到垫片生坯；C）将所述垫片生坯切片，在1500~1530℃下进行烧结，得到垫片熟片；D）将所述垫片熟片与超薄陶瓷生坯叠层放置，进行烧制，得到超薄陶瓷基板。本发明中的方法能够避免超薄陶瓷基板表面出现麻点、凹坑、鼓包等问题，本发明中的垫片熟片可回收使用，节约成本。
Sintering process of ultrathin ceramic substrate
The invention provides a sintering process of an ultrathin ceramic substrate, which comprises the following steps: A) dispersing alumina powder, a sintering aid, a dispersing agent and a solvent by first-stage ball milling, and then adding a binder and a plasticizer by second-stage ball milling to obtain slurry; the sintering aid is prepared from SiO2, MgO and CaO; the mass of the sintering aid is 0.3-0.8% of the mass of the alumina powder; b) carrying out tape casting on the slurry to obtain a gasket green body; c) slicing the gasket green body, and sintering at 1500-1530 DEG C to obtain a gasket cooked piece; d, the gasket cooked piece and an ultra-thin ceramic green body are placed in a laminated mode and fired, and the ultra-thin ceramic substrate is obtained.By means of the method, the problems that pits, pits, bumps and the like appear on the surface of the ultra-thin ceramic substrate can be avoided, the gasket cooked piece can be recycled, and cost is saved.
本发明提供了一种超薄陶瓷基板的烧结工艺，包括以下步骤：A）将氧化铝粉、烧结助剂、分散剂和溶剂一段球磨分散，然后加入粘结剂和塑化剂二段球磨分散，得到浆料；所述烧结助剂包括SiO2、MgO和CaO；所述烧结助剂的质量为所述氧化铝粉质量的0.3~0.8%；B）将所述浆料流延成型，得到垫片生坯；C）将所述垫片生坯切片，在1500~1530℃下进行烧结，得到垫片熟片；D）将所述垫片熟片与超薄陶瓷生坯叠层放置，进行烧制，得到超薄陶瓷基板。本发明中的方法能够避免超薄陶瓷基板表面出现麻点、凹坑、鼓包等问题，本发明中的垫片熟片可回收使用，节约成本。
Sintering process of ultrathin ceramic substrate
一种超薄陶瓷基板的烧结工艺
LI MENGTING (author) / WANG HONG'E (author) / HU DIE (author)
2024-11-29
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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