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Bodenbelag mit mindestens einem elektrischen Bauelement und Verfahren zur Herstellung eines Bodenbelags
A floor covering as a covering for a subfloor, wherein the floor covering has a layer which is composed of a curable material which is cured in the finished state of the floor covering and into which a reinforcing fabric and at least one electrical component are embedded. The at least one electrical component is connected by way of its bottom side to a subfloor, in particular an unfurnished floor, by adhesive bonding, and the reinforcing fabric covers the at least one electrical component by way of its side which is averted from the subfloor, so that the top side of the at least one electrical component is covered by the reinforcing fabric and the curable material.
Bodenbelag mit mindestens einem elektrischen Bauelement und Verfahren zur Herstellung eines Bodenbelags
A floor covering as a covering for a subfloor, wherein the floor covering has a layer which is composed of a curable material which is cured in the finished state of the floor covering and into which a reinforcing fabric and at least one electrical component are embedded. The at least one electrical component is connected by way of its bottom side to a subfloor, in particular an unfurnished floor, by adhesive bonding, and the reinforcing fabric covers the at least one electrical component by way of its side which is averted from the subfloor, so that the top side of the at least one electrical component is covered by the reinforcing fabric and the curable material.
Bodenbelag mit mindestens einem elektrischen Bauelement und Verfahren zur Herstellung eines Bodenbelags
BARTEL LINGG GABRIELE (author) / BARTEL ANDRE (author)
2018-03-15
Patent
Electronic Resource
German
European Patent Office | 2023
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