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POROUS PLATE-SHAPED FILLER, COATING COMPOSITION, HEAT-INSULATING FILM, AND HEAT-INSULATING FILM STRUCTURE
Provided are a heat-insulating film and a heat-insulating film structure with improved heat insulating effects. Also provided are a porous plate-shaped filler included in the heat-insulating film and a coating composition for forming the heat-insulating film. In a heat-insulating film 3 of the present invention, porous plate-shaped fillers 1 are dispersedly arranged in a matrix 3m for binding the porous plate-shaped fillers 1. In the heat-insulating film 3, the porous plate-shaped fillers 1 are preferred to be arranged (stacked) in a layered state. The porous plate-shaped filler 1 is a plate with an aspect ratio of 3 or more, and has a minimum length of 0.1 to 50 µm and a porosity of 20 to 99%. The heat-insulating film 3 using the porous plate-shaped fillers ensures a longer length of heat transfer path compared with the case where spherical or cubic fillers are used. Accordingly, the thermal conductivity can be reduced.
POROUS PLATE-SHAPED FILLER, COATING COMPOSITION, HEAT-INSULATING FILM, AND HEAT-INSULATING FILM STRUCTURE
Provided are a heat-insulating film and a heat-insulating film structure with improved heat insulating effects. Also provided are a porous plate-shaped filler included in the heat-insulating film and a coating composition for forming the heat-insulating film. In a heat-insulating film 3 of the present invention, porous plate-shaped fillers 1 are dispersedly arranged in a matrix 3m for binding the porous plate-shaped fillers 1. In the heat-insulating film 3, the porous plate-shaped fillers 1 are preferred to be arranged (stacked) in a layered state. The porous plate-shaped filler 1 is a plate with an aspect ratio of 3 or more, and has a minimum length of 0.1 to 50 µm and a porosity of 20 to 99%. The heat-insulating film 3 using the porous plate-shaped fillers ensures a longer length of heat transfer path compared with the case where spherical or cubic fillers are used. Accordingly, the thermal conductivity can be reduced.
POROUS PLATE-SHAPED FILLER, COATING COMPOSITION, HEAT-INSULATING FILM, AND HEAT-INSULATING FILM STRUCTURE
PLATTENFÖRMIGER PORÖSER FÜLLSTOFF, BESCHICHTUNGSZUSAMMENSETZUNG, WÄRMEISOLIERENDER FILM SOWIE WÄRMEISOLIERENDE FILMSTRUKTUR
CHARGE POREUSE EN FORME DE PLAQUE, COMPOSITION DE REVÊTEMENT, FILM THERMO-ISOLANT, ET STRUCTURE DE FILM THERMO-ISOLANT
TOMITA TAKAHIRO (author) / HASHIMOTO SHIGEHARU (author) / NISHIGAKI TAKU (author)
2019-03-13
Patent
Electronic Resource
English
IPC:
C08K
Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe
,
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
C04B
Kalk
,
LIME
/
C09D
Überzugsmittel, z.B. Anstrichstoffe, Firnisse oder Lacke
,
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
F02B
INTERNAL-COMBUSTION PISTON ENGINES
,
Brennkraftmaschinen mit innerer Verbrennung mit Verdrängerwirkung
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