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METHOD FOR JOINING CERAMIC TO METAL
A method for joining a metal component (210) to a ceramic component (204) is presented. The method includes disposing a metallic barrier layer (208) on a metallized portion of the ceramic component (204), and joining the metal component (210) to the metallized portion of the ceramic component (204) through the metallic barrier layer (208). The metallic barrier layer (208) comprises nickel and a melting point depressant. The metallic barrier layer (208) is disposed by a screen printing process, followed by sintering the layer at a temperature less than about 1000 degrees Celsius. A sealing structure including a joint between a ceramic component (204) and a metal component (210) is also presented.
METHOD FOR JOINING CERAMIC TO METAL
A method for joining a metal component (210) to a ceramic component (204) is presented. The method includes disposing a metallic barrier layer (208) on a metallized portion of the ceramic component (204), and joining the metal component (210) to the metallized portion of the ceramic component (204) through the metallic barrier layer (208). The metallic barrier layer (208) comprises nickel and a melting point depressant. The metallic barrier layer (208) is disposed by a screen printing process, followed by sintering the layer at a temperature less than about 1000 degrees Celsius. A sealing structure including a joint between a ceramic component (204) and a metal component (210) is also presented.
METHOD FOR JOINING CERAMIC TO METAL
VERFAHREN ZUR VERBINDUNG VON KERAMIK UND METALL
PROCÉDÉ D'ASSEMBLAGE DE MÉTAL ET DE CÉRAMIQUE
KUMAR SUNDEEP (author) / RAHMANE MOHAMED (author) / CAO HONGBO (author) / STOHR DARREN MICHAEL (author) / ADHARAPURAPU RAGHAVENDRA RAO (author) / HANUMANTHA RAVIKUMAR (author)
2021-02-17
Patent
Electronic Resource
English
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