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JUNCTION BETWEEN CERAMIC AND METAL, AND METHOD FOR JOINING CERAMIC TO METAL
PROBLEM TO BE SOLVED: To provide a metallized substrate and a junction between aluminum and ceramic, having only a relatively small deterioration in bonding strength before heat treatment even after heat treatment at a relatively high temperature.SOLUTION: A junction between ceramic and metal allows the ceramic to be joined to the metal through a bonding layer which contains Ag as main component and further contains Cu, Ti, Ni and Cr.SELECTED DRAWING: Figure 1
【課題】比較的高温で熱処理した後であっても、熱処理前の接合強度に対する劣化が比較的小さいメタライズ基板、およびアルミニウムとセラミックとの接合体を提供する。【解決手段】セラミック体と金属体との接合体であって、前記セラミック体と前記金属体とが、Ａｇを主成分とし、Ｃｕ、Ｔｉ、Ｎｉ、さらにＣｒが含有された接合層を介して接合されていることを特徴とするセラミック体と金属体との接合体を提供する。【選択図】図１
JUNCTION BETWEEN CERAMIC AND METAL, AND METHOD FOR JOINING CERAMIC TO METAL
PROBLEM TO BE SOLVED: To provide a metallized substrate and a junction between aluminum and ceramic, having only a relatively small deterioration in bonding strength before heat treatment even after heat treatment at a relatively high temperature.SOLUTION: A junction between ceramic and metal allows the ceramic to be joined to the metal through a bonding layer which contains Ag as main component and further contains Cu, Ti, Ni and Cr.SELECTED DRAWING: Figure 1
【課題】比較的高温で熱処理した後であっても、熱処理前の接合強度に対する劣化が比較的小さいメタライズ基板、およびアルミニウムとセラミックとの接合体を提供する。【解決手段】セラミック体と金属体との接合体であって、前記セラミック体と前記金属体とが、Ａｇを主成分とし、Ｃｕ、Ｔｉ、Ｎｉ、さらにＣｒが含有された接合層を介して接合されていることを特徴とするセラミック体と金属体との接合体を提供する。【選択図】図１
JUNCTION BETWEEN CERAMIC AND METAL, AND METHOD FOR JOINING CERAMIC TO METAL
セラミック体と金属体との接合体、およびセラミック体と金属体との接合方法
TANAKA ATSUSHI (author) / WATADA KAZUO (author)
2016-08-08
Patent
Electronic Resource
Japanese
IPC:
C04B
Kalk
,
LIME
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