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A platform for research: civil engineering, architecture and urbanism
Method of joining metal-ceramic substrates to metal bodies
A method of joining a metal-ceramic substrate having metallization on at least one side to a metal body by using metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.
Method of joining metal-ceramic substrates to metal bodies
A method of joining a metal-ceramic substrate having metallization on at least one side to a metal body by using metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.
Method of joining metal-ceramic substrates to metal bodies
KNOLL HEIKO (author)
2017-10-17
Patent
Electronic Resource
English
Method of Joining Metal-Ceramic Substrates to Metal Bodies
| European Patent Office | 2018