A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
BONDED BODY AND POWER MODULE SUBSTRATE
The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu-P-Sn-based brazing filler material and a Ti material, wherein a Cu-Sn layer, in which Sn forms a solid solution with Cu, is formed at a bonded interface between the ceramic member and the Cu member, and intermetallic compounds containing P and Ti are dispersed in the Cu-Sn layer.
BONDED BODY AND POWER MODULE SUBSTRATE
The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu-P-Sn-based brazing filler material and a Ti material, wherein a Cu-Sn layer, in which Sn forms a solid solution with Cu, is formed at a bonded interface between the ceramic member and the Cu member, and intermetallic compounds containing P and Ti are dispersed in the Cu-Sn layer.
BONDED BODY AND POWER MODULE SUBSTRATE
VERBUNDKÖRPER UND LEISTUNGSMODULSUBSTRAT
CORPS COLLÉ ET SUBSTRAT DE MODULE DE PUISSANCE
TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author)
2019-09-18
Patent
Electronic Resource
English
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