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COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, COPPER/CERAMIC JOINT PRODUCING METHOD, INSULATED CIRCUIT BOARD PRODUCING METHOD
To provide a copper/ceramic joint, an insulated circuit board, a copper/ceramic joint producing method, an insulated circuit board producing method, that can suppress ceramic member and a copper member being peeled off and cracking occurrence in the ceramic member even when ultrasonic joining is executed.SOLUTION: There is provided a Copper/Ceramic joint 10 formed by joining a copper member 12 made of copper or a copper alloy and a ceramic member 11 made of silicon nitride. There is a Mg-N compound phase 41 extending from the ceramic member 11 side to the copper member 12 side at a joint interface between the copper member 12 and the ceramic member 11. At least one part of the Mg-N compound phase 41 enters the copper member 12.SELECTED DRAWING: Figure 2
【課題】超音波接合を行った場合であっても、セラミックス部材と銅部材との剥離や、セラミックス部材でのクラックの発生を抑制することが可能な銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、窒化ケイ素からなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、銅部材１２とセラミックス部材１１との接合界面においては、セラミックス部材１１側から銅部材１２側に向けて延在するＭｇ−Ｎ化合物相４１が存在しており、Ｍｇ−Ｎ化合物相４１の少なくとも一部が銅部材１２に入り込んでいることを特徴とする。【選択図】図２
COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, COPPER/CERAMIC JOINT PRODUCING METHOD, INSULATED CIRCUIT BOARD PRODUCING METHOD
To provide a copper/ceramic joint, an insulated circuit board, a copper/ceramic joint producing method, an insulated circuit board producing method, that can suppress ceramic member and a copper member being peeled off and cracking occurrence in the ceramic member even when ultrasonic joining is executed.SOLUTION: There is provided a Copper/Ceramic joint 10 formed by joining a copper member 12 made of copper or a copper alloy and a ceramic member 11 made of silicon nitride. There is a Mg-N compound phase 41 extending from the ceramic member 11 side to the copper member 12 side at a joint interface between the copper member 12 and the ceramic member 11. At least one part of the Mg-N compound phase 41 enters the copper member 12.SELECTED DRAWING: Figure 2
【課題】超音波接合を行った場合であっても、セラミックス部材と銅部材との剥離や、セラミックス部材でのクラックの発生を抑制することが可能な銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、窒化ケイ素からなるセラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、銅部材１２とセラミックス部材１１との接合界面においては、セラミックス部材１１側から銅部材１２側に向けて延在するＭｇ−Ｎ化合物相４１が存在しており、Ｍｇ−Ｎ化合物相４１の少なくとも一部が銅部材１２に入り込んでいることを特徴とする。【選択図】図２
COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, COPPER/CERAMIC JOINT PRODUCING METHOD, INSULATED CIRCUIT BOARD PRODUCING METHOD
銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
TERASAKI NOBUYUKI (author)
2021-03-04
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2021
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| European Patent Office | 2023