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COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, COPPER/CERAMIC JOINT PRODUCING METHOD, INSULATED CIRCUIT BOARD PRODUCING METHOD
To provide a copper/ceramic joint having an excellent ultrasonic joining property, in which, even when ultrasonic joining is executed, ceramic member and copper member can be suppressed from being peeled off and occurrence of cracking in the ceramic member can be suppressed.SOLUTION: There is provided a Copper/Ceramic joint formed by joining a copper member 12 made of copper or a copper alloy and a ceramic member 11. Cu-Mg intermetallic compound phase 45 composed of an intermetallic compound containing Cu and Mg is formed between the ceramic member 11 and the copper member 12. The area ratio of the Cu-Mg intermetallic compound phase 45 in a region up to 50 μm from the joint surface of the ceramic member 11 to the side of the copper member 12 is within a range of 20% or more and 45% or less.SELECTED DRAWING: Figure 2
【課題】超音波接合を行った場合であってもセラミックス部材と銅部材との剥離を抑制することができるとともにセラミックス部材の割れの発生を抑制することができ、超音波接合性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、セラミックス部材１１と銅部材１２との間には、ＣｕとＭｇを含む金属間化合物からなるＣｕ−Ｍｇ金属間化合物相４５が形成されており、セラミックス部材１１の接合面から銅部材１２側へ５０μｍまでの領域におけるＣｕ−Ｍｇ金属間化合物相４５の面積率が２０％以上４５％以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, COPPER/CERAMIC JOINT PRODUCING METHOD, INSULATED CIRCUIT BOARD PRODUCING METHOD
To provide a copper/ceramic joint having an excellent ultrasonic joining property, in which, even when ultrasonic joining is executed, ceramic member and copper member can be suppressed from being peeled off and occurrence of cracking in the ceramic member can be suppressed.SOLUTION: There is provided a Copper/Ceramic joint formed by joining a copper member 12 made of copper or a copper alloy and a ceramic member 11. Cu-Mg intermetallic compound phase 45 composed of an intermetallic compound containing Cu and Mg is formed between the ceramic member 11 and the copper member 12. The area ratio of the Cu-Mg intermetallic compound phase 45 in a region up to 50 μm from the joint surface of the ceramic member 11 to the side of the copper member 12 is within a range of 20% or more and 45% or less.SELECTED DRAWING: Figure 2
【課題】超音波接合を行った場合であってもセラミックス部材と銅部材との剥離を抑制することができるとともにセラミックス部材の割れの発生を抑制することができ、超音波接合性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体であって、セラミックス部材１１と銅部材１２との間には、ＣｕとＭｇを含む金属間化合物からなるＣｕ−Ｍｇ金属間化合物相４５が形成されており、セラミックス部材１１の接合面から銅部材１２側へ５０μｍまでの領域におけるＣｕ−Ｍｇ金属間化合物相４５の面積率が２０％以上４５％以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC JOINT, INSULATED CIRCUIT BOARD, COPPER/CERAMIC JOINT PRODUCING METHOD, INSULATED CIRCUIT BOARD PRODUCING METHOD
銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
TERASAKI NOBUYUKI (author)
2021-03-01
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2023