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HEAT-DISSIPATING MEMBER AND ELECTRONIC DEVICE USING SAME
A heat-dissipating member according to the present disclosure includes aluminum oxide ceramics that includes crystal particles of aluminum oxide. The aluminum oxide ceramics includes 98 mass% or higher of aluminum in terms of AlOwith respect to 100 mass% of all constituents . The crystal particles have an average equivalent circle diameter of 1.6 µm or more and 2.4 µm or less. In an equivalent circle diameter cumulative distribution curve of the crystal particles, a difference between an equivalent circle diameter at 10 cumulative percent (d10) and an equivalent circle diameter at 90 cumulative percent (d90) is 2.1 µm or more and 4.2 µm or less.
HEAT-DISSIPATING MEMBER AND ELECTRONIC DEVICE USING SAME
A heat-dissipating member according to the present disclosure includes aluminum oxide ceramics that includes crystal particles of aluminum oxide. The aluminum oxide ceramics includes 98 mass% or higher of aluminum in terms of AlOwith respect to 100 mass% of all constituents . The crystal particles have an average equivalent circle diameter of 1.6 µm or more and 2.4 µm or less. In an equivalent circle diameter cumulative distribution curve of the crystal particles, a difference between an equivalent circle diameter at 10 cumulative percent (d10) and an equivalent circle diameter at 90 cumulative percent (d90) is 2.1 µm or more and 4.2 µm or less.
HEAT-DISSIPATING MEMBER AND ELECTRONIC DEVICE USING SAME
WÄRMEABLEITENDES ELEMENT UND ELEKTRONISCHE VORRICHTUNG DAMIT
ÉLÉMENT DE DISSIPATION DE CHALEUR ET DISPOSITIF ÉLECTRONIQUE L'UTILISANT
MATSUSHITA KOUJI (author)
2021-05-26
Patent
Electronic Resource
English
IPC:
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
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