A platform for research: civil engineering, architecture and urbanism
HEAT-DISSIPATING MEMBER AND ELECTRONIC DEVICE USING SAME
A heat-dissipating member includes aluminum oxide ceramics that includes crystal particles of aluminum oxide. The aluminum oxide ceramics includes 98 mass % or higher of aluminum in terms of Al2O3 with respect to 100 mass % of all constituents. The crystal particles have an average equivalent circle diameter of 1.6 μm or more and 2.4 μm or less. An equivalent circle diameter cumulative distribution curve of the crystal particles has a first diameter at 10 cumulative percent and a second diameter at 90 cumulative percent that is different from the first diameter by 2.1 μm or more and 4.2 μm or less.
HEAT-DISSIPATING MEMBER AND ELECTRONIC DEVICE USING SAME
A heat-dissipating member includes aluminum oxide ceramics that includes crystal particles of aluminum oxide. The aluminum oxide ceramics includes 98 mass % or higher of aluminum in terms of Al2O3 with respect to 100 mass % of all constituents. The crystal particles have an average equivalent circle diameter of 1.6 μm or more and 2.4 μm or less. An equivalent circle diameter cumulative distribution curve of the crystal particles has a first diameter at 10 cumulative percent and a second diameter at 90 cumulative percent that is different from the first diameter by 2.1 μm or more and 4.2 μm or less.
HEAT-DISSIPATING MEMBER AND ELECTRONIC DEVICE USING SAME
MATSUSHITA KOUJI (author)
2020-02-13
Patent
Electronic Resource
English
IPC:
F28F
Einzelheiten von Wärmetauschern oder Wärmeübertragungsvorrichtungen für allgemeine Verwendung
,
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
/
C04B
Kalk
,
LIME
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
HEAT-DISSIPATING MEMBER AND ELECTRONIC DEVICE USING SAME
European Patent Office | 2021
|HEAT-DISSIPATING MEMBER AND ELECTRONIC DEVICE USING SAME
European Patent Office | 2018
|Heat-dissipating member and electronic device using same
European Patent Office | 2022
|HEAT-DISSIPATING MEMBER AND MANUFACTURING METHOD FOR SAME
European Patent Office | 2024
|