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A platform for research: civil engineering, architecture and urbanism
METHOD OF MANUFACTURING INSULATING CIRCUIT BOARD WITH HEATSINK
What is provided is a method of manufacturing an insulating circuit board with a heatsink including an insulating circuit board and a heatsink, the heatsink being bonded to the metal layer side of the insulating circuit board, the metal layer being formed of aluminum, and a bonding surface of the heatsink with the insulating circuit board being formed of an aluminum alloy having a solidus temperature of 650°C or lower. This method includes a high alloy element concentration portion forming step (S02) of forming a high alloy element concentration portion and a heatsink bonding step (S03) of bonding the heatsink, in which a ratio tb/ta of a thickness tb of the brazing material layer to a thickness ta of the core material in the clad material is in a range of 0.1 to 0.3.
METHOD OF MANUFACTURING INSULATING CIRCUIT BOARD WITH HEATSINK
What is provided is a method of manufacturing an insulating circuit board with a heatsink including an insulating circuit board and a heatsink, the heatsink being bonded to the metal layer side of the insulating circuit board, the metal layer being formed of aluminum, and a bonding surface of the heatsink with the insulating circuit board being formed of an aluminum alloy having a solidus temperature of 650°C or lower. This method includes a high alloy element concentration portion forming step (S02) of forming a high alloy element concentration portion and a heatsink bonding step (S03) of bonding the heatsink, in which a ratio tb/ta of a thickness tb of the brazing material layer to a thickness ta of the core material in the clad material is in a range of 0.1 to 0.3.
METHOD OF MANUFACTURING INSULATING CIRCUIT BOARD WITH HEATSINK
VERFAHREN ZUR HERSTELLUNG EINER ISOLIERENDEN LEITERPLATTE MIT KÜHLKÖRPER
PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ ISOLANTE AVEC DISSIPATEUR THERMIQUE
KITAHARA TAKESHI (author) / NAGATOMO YOSHIYUKI (author)
2023-10-25
Patent
Electronic Resource
English
| European Patent Office | 2021
| European Patent Office | 2018