A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
To provide insulated circuit boards with high reliability by suppressing delamination of metal layers even in environments where cold and heat are repeatedly applied.SOLUTION: A ceramic substrate and a metal layer formed on the surface of the ceramic substrate, the metal layer is made of aluminum with a purity of 99.99 mass% or higher, the Cu content is 30 ppm or lower, the standard deviation of the crystal grain diameter measured in plan view of the metal layer is less than 1 mm, and the total Fe, Mn, Cr, Be, and Mg content is less than 35 ppm in total.SELECTED DRAWING: Figure 1
【課題】冷熱が繰り返される環境においても金属層の剥離を抑制し、信頼性の高い絶縁回路基板を提供する。【解決手段】セラミックス基板と該セラミックス基板の表面に形成された金属層とを備え、前記金属層は、純度９９．９９質量％以上のアルミニウムからなるとともに、Ｃｕの含有量が３０ｐｐｍ以下であり、前記金属層の平面視で計測される結晶粒径の標準偏差が１ｍｍ未満であり、Ｆｅ，Ｍｎ，Ｃｒ，Ｂｅ，Ｍｇの含有量の合計が３５ｐｐｍ以下である。【選択図】 図１
To provide insulated circuit boards with high reliability by suppressing delamination of metal layers even in environments where cold and heat are repeatedly applied.SOLUTION: A ceramic substrate and a metal layer formed on the surface of the ceramic substrate, the metal layer is made of aluminum with a purity of 99.99 mass% or higher, the Cu content is 30 ppm or lower, the standard deviation of the crystal grain diameter measured in plan view of the metal layer is less than 1 mm, and the total Fe, Mn, Cr, Be, and Mg content is less than 35 ppm in total.SELECTED DRAWING: Figure 1
【課題】冷熱が繰り返される環境においても金属層の剥離を抑制し、信頼性の高い絶縁回路基板を提供する。【解決手段】セラミックス基板と該セラミックス基板の表面に形成された金属層とを備え、前記金属層は、純度９９．９９質量％以上のアルミニウムからなるとともに、Ｃｕの含有量が３０ｐｐｍ以下であり、前記金属層の平面視で計測される結晶粒径の標準偏差が１ｍｍ未満であり、Ｆｅ，Ｍｎ，Ｃｒ，Ｂｅ，Ｍｇの含有量の合計が３５ｐｐｍ以下である。【選択図】 図１
INSULATING CIRCUIT BOARD
絶縁回路基板
KIMIYA SHUN (author)
2023-10-05
Patent
Electronic Resource
Japanese
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