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A platform for research: civil engineering, architecture and urbanism
MANUFACTURING METHOD FOR INSULATING CIRCUIT BOARD
To provide a manufacturing method for an insulating circuit board by which the displacement at the bonding of a first metal plate and a second metal plate to a ceramic substrate can be suppressed and the amount of curvature can be reduced.SOLUTION: A manufacturing method for an insulating circuit board includes a bonding step of bonding a stack of a first metal plate, a ceramic substrate, and a second metal plate in a state where the stack is pressed in a stacking direction. In the bonding step, a first pressing plate with a convex curved surface for pressing the first metal plate and a second pressing plate with a concave curved surface for pressing the second metal plate are used and a first surface of the first metal plate is pressed with the convex curved surface through a first contact plate and a second surface of the second metal plate is pressed with the concave curved surface through a second contact plate. Thus, the stack is held and deformed between the first contact plate and the second contact plate, and in this state, the stack is heated. Each of the first pressing plate and the second pressing plate is made of a plate material with a Young's modulus of 100 GPa or more. Each of the first contact plate and the second contact plate has a Young's modulus of 1 GPa or more and 70 GPa or less and a thickness of 0.5 mm or more and 50 mm or less.SELECTED DRAWING: Figure 4
【課題】セラミックス基板に対する第１金属板及び前記第２金属板の接合時の位置ずれを抑制でき、かつ、反り量を低減できる絶縁回路基板の製造方法を提供すること。【解決手段】第１金属板、セラミックス基板及び第２金属板の積層体を積層方向に押圧した状態で接合する接合工程を有し、接合工程では、第１金属板を押圧する凸曲面を有する第１押圧板と第２金属板を押圧する凹曲面を有する第２押圧板とを用い、第１金属板の第１面を第１接触板を介して凸曲面で押圧するともに、第２金属板の第２面を第２接触板を介して凹曲面で押圧することにより、積層体を第１接触板及び第２接触板との間に挟持して変形させた状態で加熱し、第１押圧板及び第２押圧板はヤング率が１００ＧＰａ以上の板材からなるとともに、第１接触板及び第２接触板は、ヤング率が１ＧＰａ以上７０ＧＰａ以下、厚さが０．５ｍｍ以上５０ｍｍ以下に設定されている。【選択図】図４
MANUFACTURING METHOD FOR INSULATING CIRCUIT BOARD
To provide a manufacturing method for an insulating circuit board by which the displacement at the bonding of a first metal plate and a second metal plate to a ceramic substrate can be suppressed and the amount of curvature can be reduced.SOLUTION: A manufacturing method for an insulating circuit board includes a bonding step of bonding a stack of a first metal plate, a ceramic substrate, and a second metal plate in a state where the stack is pressed in a stacking direction. In the bonding step, a first pressing plate with a convex curved surface for pressing the first metal plate and a second pressing plate with a concave curved surface for pressing the second metal plate are used and a first surface of the first metal plate is pressed with the convex curved surface through a first contact plate and a second surface of the second metal plate is pressed with the concave curved surface through a second contact plate. Thus, the stack is held and deformed between the first contact plate and the second contact plate, and in this state, the stack is heated. Each of the first pressing plate and the second pressing plate is made of a plate material with a Young's modulus of 100 GPa or more. Each of the first contact plate and the second contact plate has a Young's modulus of 1 GPa or more and 70 GPa or less and a thickness of 0.5 mm or more and 50 mm or less.SELECTED DRAWING: Figure 4
【課題】セラミックス基板に対する第１金属板及び前記第２金属板の接合時の位置ずれを抑制でき、かつ、反り量を低減できる絶縁回路基板の製造方法を提供すること。【解決手段】第１金属板、セラミックス基板及び第２金属板の積層体を積層方向に押圧した状態で接合する接合工程を有し、接合工程では、第１金属板を押圧する凸曲面を有する第１押圧板と第２金属板を押圧する凹曲面を有する第２押圧板とを用い、第１金属板の第１面を第１接触板を介して凸曲面で押圧するともに、第２金属板の第２面を第２接触板を介して凹曲面で押圧することにより、積層体を第１接触板及び第２接触板との間に挟持して変形させた状態で加熱し、第１押圧板及び第２押圧板はヤング率が１００ＧＰａ以上の板材からなるとともに、第１接触板及び第２接触板は、ヤング率が１ＧＰａ以上７０ＧＰａ以下、厚さが０．５ｍｍ以上５０ｍｍ以下に設定されている。【選択図】図４
MANUFACTURING METHOD FOR INSULATING CIRCUIT BOARD
絶縁回路基板の製造方法
AOKI SHINSUKE (author) / KATO HIROKAZU (author)
2021-09-16
Patent
Electronic Resource
Japanese
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