A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
According to the present invention, there is provided a copper/ceramic bonded body including: a copper member made of copper or a copper alloy; and a ceramic member made of silicon-containing ceramics, the copper member and the ceramic member being bonded to each other, in which a maximum indentation hardness in a region is set to be in a range of 70 mgf/µm2 or more and 150 mgf/µm2 or less, the region being from 10 µm to 50 µm with reference to a bonded interface between the copper member and the ceramic member toward the copper member side.
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
According to the present invention, there is provided a copper/ceramic bonded body including: a copper member made of copper or a copper alloy; and a ceramic member made of silicon-containing ceramics, the copper member and the ceramic member being bonded to each other, in which a maximum indentation hardness in a region is set to be in a range of 70 mgf/µm2 or more and 150 mgf/µm2 or less, the region being from 10 µm to 50 µm with reference to a bonded interface between the copper member and the ceramic member toward the copper member side.
COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
KUPFER/KERAMIK-VERBUNDKÖRPER UND ISOLIERENDE SCHALTUNGSPLATTE
CORPS ASSEMBLÉ EN CUIVRE/CÉRAMIQUE ET CARTE DE CIRCUIT IMPRIMÉ ISOLÉE
TERASAKI NOBUYUKI (author)
2024-02-28
Patent
Electronic Resource
English