A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC JOINED BODY, AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joined body that can suppress the occurrence of crack in the ceramic member even when a severe thermal cycle is applied, and has excellent thermal cycle reliability.SOLUTION: Provided is a copper/ceramic joined body 10 which is formed by joining copper members 12 and 13 made of copper or a copper alloy, and a ceramic member 11, and in which, at a joint interface between the ceramic member 11 and the copper members 12, 13, an active metal compound layer 21 is formed on the ceramic member 11 side, and, in a field of view extending for 200 μm in a width direction of the joint interface in a cross section along a direction of lamination between the ceramic member 11 and the copper members 12 and 13, and extending for 10 μm from the surface of the active metal compound layer 21 toward the copper members 12 and 13 side, an area A of the active metal-containing precipitate is 360 μm2 or less, and a ratio A/B between the area A of the active metal-containing precipitate and an area B of an Ag-enriched phase having an Ag concentration of 10 atm % or more is within a range of 0.03 or more and 0.8 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２，１３との接合界面において、セラミックス部材１１側には活性金属化合物層２１が形成されており、セラミックス部材１１と銅部材１２，１３との積層方向に沿った断面における接合界面の幅方向に２００μｍおよび活性金属化合物層２１の表面から銅部材１２，１３側へ１０μｍの視野において、活性金属含有析出物の面積Ａが３６０μｍ２以下とされるとともに、活性金属含有析出物の面積ＡとＡｇ濃度が１０原子％以上であるＡｇ濃化相の面積Ｂとの比Ａ／Ｂが０．０３以上０．８以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC JOINED BODY, AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joined body that can suppress the occurrence of crack in the ceramic member even when a severe thermal cycle is applied, and has excellent thermal cycle reliability.SOLUTION: Provided is a copper/ceramic joined body 10 which is formed by joining copper members 12 and 13 made of copper or a copper alloy, and a ceramic member 11, and in which, at a joint interface between the ceramic member 11 and the copper members 12, 13, an active metal compound layer 21 is formed on the ceramic member 11 side, and, in a field of view extending for 200 μm in a width direction of the joint interface in a cross section along a direction of lamination between the ceramic member 11 and the copper members 12 and 13, and extending for 10 μm from the surface of the active metal compound layer 21 toward the copper members 12 and 13 side, an area A of the active metal-containing precipitate is 360 μm2 or less, and a ratio A/B between the area A of the active metal-containing precipitate and an area B of an Ag-enriched phase having an Ag concentration of 10 atm % or more is within a range of 0.03 or more and 0.8 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２，１３と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２，１３との接合界面において、セラミックス部材１１側には活性金属化合物層２１が形成されており、セラミックス部材１１と銅部材１２，１３との積層方向に沿った断面における接合界面の幅方向に２００μｍおよび活性金属化合物層２１の表面から銅部材１２，１３側へ１０μｍの視野において、活性金属含有析出物の面積Ａが３６０μｍ２以下とされるとともに、活性金属含有析出物の面積ＡとＡｇ濃度が１０原子％以上であるＡｇ濃化相の面積Ｂとの比Ａ／Ｂが０．０３以上０．８以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC JOINED BODY, AND INSULATED CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TERASAKI NOBUYUKI (author)
2023-01-26
Patent
Electronic Resource
Japanese