A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
INSULATED CIRCUIT BOARD
In an insulating circuit substrate (10), aluminum sheets (12, 13) formed of aluminum or an aluminum alloy are laminated and bonded to a surface of a ceramic substrate (11) and, in the aluminum sheets (12, 13), Cu is solid-solubilized at a bonding interface with the ceramic substrate (11) and a ratio B/A between a Cu concentration A mass% at the bonding interface and a Cu concentration B mass% at a position of 100 µm in a thickness direction from the bonding interface to the aluminum sheets (12, 13) side is 0.30 or more and 0.85 or less.
INSULATED CIRCUIT BOARD
In an insulating circuit substrate (10), aluminum sheets (12, 13) formed of aluminum or an aluminum alloy are laminated and bonded to a surface of a ceramic substrate (11) and, in the aluminum sheets (12, 13), Cu is solid-solubilized at a bonding interface with the ceramic substrate (11) and a ratio B/A between a Cu concentration A mass% at the bonding interface and a Cu concentration B mass% at a position of 100 µm in a thickness direction from the bonding interface to the aluminum sheets (12, 13) side is 0.30 or more and 0.85 or less.
INSULATED CIRCUIT BOARD
ISOLIERTE LEITERPLATTE
CARTE DE CIRCUIT ISOLÉE
SAKURAI AKIRA (author) / TERASAKI NOBUYUKI (author)
2024-04-24
Patent
Electronic Resource
English
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