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TRÄGERSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG EINES TRÄGERSUBSTRATS
The invention relates to a method for producing a support substrate (1), in particular a metal-ceramic substrate, according to one of the previous claims, having the steps of: - providing at least one metal layer (10) and an insulating element (30), in particular a ceramic element (30), a glass element, a glass-ceramic element, and/or a high temperature-resistant plastic element, said at least one metal layer (10) and insulating element (30) extending along a main extension plane (HSE), - arranging the at least one metal layer (10) and the insulating element (30) one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein an active metal layer (15) is arranged between the at least one metal layer (10) and the insulating element (30), and - binding the at least one metal layer (10) to the insulating element (30) via the active metal layer (15), thereby forming a binding layer (13) between the at least one metal layer (10) and the insulating element (30), a structured binding layer (12) being formed in particular during the binding process.
TRÄGERSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG EINES TRÄGERSUBSTRATS
The invention relates to a method for producing a support substrate (1), in particular a metal-ceramic substrate, according to one of the previous claims, having the steps of: - providing at least one metal layer (10) and an insulating element (30), in particular a ceramic element (30), a glass element, a glass-ceramic element, and/or a high temperature-resistant plastic element, said at least one metal layer (10) and insulating element (30) extending along a main extension plane (HSE), - arranging the at least one metal layer (10) and the insulating element (30) one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein an active metal layer (15) is arranged between the at least one metal layer (10) and the insulating element (30), and - binding the at least one metal layer (10) to the insulating element (30) via the active metal layer (15), thereby forming a binding layer (13) between the at least one metal layer (10) and the insulating element (30), a structured binding layer (12) being formed in particular during the binding process.
TRÄGERSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG EINES TRÄGERSUBSTRATS
CARRIER SUBSTRATE AND MANUFACTURING PROCESS OF A CARRIER SUBSTRATE
SUBSTRAT DE SUPPORT ET PROCÉDÉ DE FABRICATION D'UN SUBSRTAT DE SUPPORT
SCHMIDT KARSTEN (author) / WELKER TILO (author) / MEYER ANDREAS (author) / BRITTING STEFAN (author)
2024-04-10
Patent
Electronic Resource
German
IPC:
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
TRÄGERSUBSTRAT FÜR ELEKTRISCHE BAUTEILE UND VERFAHREN ZUR HERSTELLUNG EINES SOLCHEN TRÄGERSUBSTRATS
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