A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
HEAT-CONDUCTIVE RESIN COMPOSITION AND HEAT DISSIPATION SHEET
The present invention provides a heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes a first inorganic filler and a second inorganic filler, a particle size distribution of the inorganic filler component has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second inorganic filler, a particle diameter at the first maximum point is 15 pm or more, a particle diameter at the second maximum point is 2/3 or less of the particle diameter at the first maximum point, an integrated amount of frequency between a peak start and a peak end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet of the present invention is obtained by molding the heat-conductive resin composition of the present invention. According to the present invention, it is possible to provide a heat-conductive resin composition having excellent thermal conductivity suitable for producing a thin molded body and a heat dissipation sheet formed by molding the heat-conductive resin composition.
HEAT-CONDUCTIVE RESIN COMPOSITION AND HEAT DISSIPATION SHEET
The present invention provides a heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes a first inorganic filler and a second inorganic filler, a particle size distribution of the inorganic filler component has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second inorganic filler, a particle diameter at the first maximum point is 15 pm or more, a particle diameter at the second maximum point is 2/3 or less of the particle diameter at the first maximum point, an integrated amount of frequency between a peak start and a peak end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet of the present invention is obtained by molding the heat-conductive resin composition of the present invention. According to the present invention, it is possible to provide a heat-conductive resin composition having excellent thermal conductivity suitable for producing a thin molded body and a heat dissipation sheet formed by molding the heat-conductive resin composition.
HEAT-CONDUCTIVE RESIN COMPOSITION AND HEAT DISSIPATION SHEET
WÄRMELEITENDE HARZZUSAMMENSETZUNG UND WÄRMEABLEITUNGSFOLIE
COMPOSITION DE RÉSINE THERMOCONDUCTRICE ET FEUILLE DE DISSIPATION DE CHALEUR
WADA KOSUKE (author) / FUJI KIYOTAKA (author) / TANIGUCHI YOSHITAKA (author)
2024-10-09
Patent
Electronic Resource
English
| European Patent Office | 2024
| European Patent Office | 2020
Thermal conductive member and heat dissipation structure including the same
| European Patent Office | 2021