A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
ULTRAFAST HIGH-TEMPERATURE SINTERING METHOD
The present invention relates to a method for producing a sintered inorganic substrate, comprising providing an inorganic substrate between a first and a second carbon-comprising thermally conductive substrate, providing the first and the second thermally conductive substrate and the inorganic substrate between a third and a fourth thermally conductive substrate, heating the third and/or the fourth thermally conductive substrate at a heating rate of at least 50 °C/s to a temperature between 750 °C and 1400 °C, thereby heating the first and/or the second thermally conductive substrate, respectively, and sintering the inorganic substrate by heating the inorganic substrate at a temperature between 750 °C and 1400 °C with the heated first and/or second thermally conductive substrate, wherein the third and the fourth thermally conductive substrates comprise, independently from one another, one or more of a monocrystalline metal oxide and/or a monocrystalline metal nitride.
ULTRAFAST HIGH-TEMPERATURE SINTERING METHOD
The present invention relates to a method for producing a sintered inorganic substrate, comprising providing an inorganic substrate between a first and a second carbon-comprising thermally conductive substrate, providing the first and the second thermally conductive substrate and the inorganic substrate between a third and a fourth thermally conductive substrate, heating the third and/or the fourth thermally conductive substrate at a heating rate of at least 50 °C/s to a temperature between 750 °C and 1400 °C, thereby heating the first and/or the second thermally conductive substrate, respectively, and sintering the inorganic substrate by heating the inorganic substrate at a temperature between 750 °C and 1400 °C with the heated first and/or second thermally conductive substrate, wherein the third and the fourth thermally conductive substrates comprise, independently from one another, one or more of a monocrystalline metal oxide and/or a monocrystalline metal nitride.
ULTRAFAST HIGH-TEMPERATURE SINTERING METHOD
ULTRASCHNELLES HOCHTEMPERATURSINTERVERFAHREN
PROCÉDÉ DE FRITTAGE ULTRARAPIDE À HAUTE TEMPÉRATURE
ZHANG HUANYU (author) / OKUR FARUK (author) / KRAVCHYK KOSTIANTYN (author) / PFENNINGER RETO (author) / DUBEY ROMAIN JEAN-CHRISTOPHE (author) / KOVALENKO MAKSYM (author)
2024-04-10
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
/
F27D
Einzelheiten oder Zubehör für Industrieöfen, Schachtöfen, Brennöfen oder Retorten, soweit sie nicht auf eine Ofenart eingeschränkt sind
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