A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body (10) obtained by bonding copper members (12) and (13) consisting of copper or a copper alloy to a ceramic member (11), where at a bonded interface between the ceramic member (11) and each of the copper members (12) and (13), the distance between the ceramic member (11) and each of the copper members (12) and (13) in an end portion of each of the copper members (12) and (13) is in a range of 3 µm or more and 30 µm or less, and a void ratio in an end portion region (E) of each of the copper members (12) and (13) is 10% or less.
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body (10) obtained by bonding copper members (12) and (13) consisting of copper or a copper alloy to a ceramic member (11), where at a bonded interface between the ceramic member (11) and each of the copper members (12) and (13), the distance between the ceramic member (11) and each of the copper members (12) and (13) in an end portion of each of the copper members (12) and (13) is in a range of 3 µm or more and 30 µm or less, and a void ratio in an end portion region (E) of each of the copper members (12) and (13) is 10% or less.
COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT BOARD
KUPFER/KERAMIK VERBUNDKÖRPER UND ISOLIERTE LEITERPLATTE
CORPS COLLÉ CUIVRE/CÉRAMIQUE ET CIRCUIT IMPRIMÉ ISOLÉ
TERASAKI NOBUYUKI (author)
2024-06-05
Patent
Electronic Resource
English