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SPUTTERING TARGET MATERIAL AND SPUTTERING TARGET
A sputtering target material includes a sintered ceramics of an oxide containing potassium, sodium, niobium, and oxygen, wherein when a volume resistivity at 25 °C is less than 6.0 × 1011 Ω·cm, a Vickers hardness is 460 or more, and a flexural strength is 90 MPa or more, or wherein when a volume resistivity at 25 °C is 6.0 × 1011 Ω·cm or more, a Vickers hardness is 250 or more, and a flexural strength is 90 MPa or more.
SPUTTERING TARGET MATERIAL AND SPUTTERING TARGET
A sputtering target material includes a sintered ceramics of an oxide containing potassium, sodium, niobium, and oxygen, wherein when a volume resistivity at 25 °C is less than 6.0 × 1011 Ω·cm, a Vickers hardness is 460 or more, and a flexural strength is 90 MPa or more, or wherein when a volume resistivity at 25 °C is 6.0 × 1011 Ω·cm or more, a Vickers hardness is 250 or more, and a flexural strength is 90 MPa or more.
SPUTTERING TARGET MATERIAL AND SPUTTERING TARGET
SPUTTERTARGETMATERIAL UND SPUTTERTARGET
MATÉRIAU DE CIBLE DE PULVÉRISATION ET CIBLE DE PULVÉRISATION
NAKATA KUNIHIKO (author) / NISHIOKA KOJI (author)
2024-09-25
Patent
Electronic Resource
English