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SPUTTERING TARGET FOR FORMATION OF SOLID ELECTROLYTE THIN FILM AND THIN FILM
PROBLEM TO BE SOLVED: To provide a sputtering target for allowing stably depositing a homogeneous thin film of solid electrolyte material for a lithium ion secondary battery by sputtering.SOLUTION: Raw material powders for Li source and raw material powders for B source are weighed such that Li/B atomic ratio is 2.9 - 3.1. The raw material powders are sintered at 650°C - 700°C. A produced sintered body is processed to a target shape to provide a sputtering target having a composition of LiBO(x and y are in atomic%, and satisfy 2.9≤x/y≤3.1). The sputtering target includes Al:less than 100 wtppm, Ca: less than 500 wtppm, Fe: less than 10 wtppm, Na: less than 500 wtppm, Ni:less than 10 wtppm, Si: less than 150 wtppm, Cu: less than 10 wtppm, and K: less than 150 wtppm. The total amount of the metals is less than 100 wtppm.
【課題】リチウムイオン二次電池用の固体電解質材料である均質な固体電解質の薄膜を、スパッタリングによって安定的に成膜できるスパッタリングターゲットの提供。【解決手段】Ｌｉ源となる原料粉末とＢ源となる原料粉末とをＬｉ／Ｂの原子比率が２．９〜３．１となるように秤量し、該原料粉末を６５０℃〜７００℃で焼結し、作製された焼結体をターゲットの形状に加工した、ＬｉxＢyＯ3（ｘ、ｙは原子％で、２．９≰ｘ／ｙ≰３．１）で示される組成からなるスパッタリングターゲット。Ａｌ：１００ｗｔｐｐｍ未満、Ｃａ：５００ｗｔｐｐｍ未満、Ｆｅ：１０ｗｔｐｐｍ未満、Ｎａ：５００ｗｔｐｐｍ未満、Ｎｉ：１０ｗｔｐｐｍ未満、Ｓｉ：１５０ｗｔｐｐｍ未満、Ｃｕ：１０ｗｔｐｐｍ未満、Ｋ：１５０ｗｔｐｐｍ未満であり、前記金属の含有合計量が１００ｗｔｐｐｍ未満であるスパッタリングターゲット。【選択図】なし
SPUTTERING TARGET FOR FORMATION OF SOLID ELECTROLYTE THIN FILM AND THIN FILM
PROBLEM TO BE SOLVED: To provide a sputtering target for allowing stably depositing a homogeneous thin film of solid electrolyte material for a lithium ion secondary battery by sputtering.SOLUTION: Raw material powders for Li source and raw material powders for B source are weighed such that Li/B atomic ratio is 2.9 - 3.1. The raw material powders are sintered at 650°C - 700°C. A produced sintered body is processed to a target shape to provide a sputtering target having a composition of LiBO(x and y are in atomic%, and satisfy 2.9≤x/y≤3.1). The sputtering target includes Al:less than 100 wtppm, Ca: less than 500 wtppm, Fe: less than 10 wtppm, Na: less than 500 wtppm, Ni:less than 10 wtppm, Si: less than 150 wtppm, Cu: less than 10 wtppm, and K: less than 150 wtppm. The total amount of the metals is less than 100 wtppm.
【課題】リチウムイオン二次電池用の固体電解質材料である均質な固体電解質の薄膜を、スパッタリングによって安定的に成膜できるスパッタリングターゲットの提供。【解決手段】Ｌｉ源となる原料粉末とＢ源となる原料粉末とをＬｉ／Ｂの原子比率が２．９〜３．１となるように秤量し、該原料粉末を６５０℃〜７００℃で焼結し、作製された焼結体をターゲットの形状に加工した、ＬｉxＢyＯ3（ｘ、ｙは原子％で、２．９≰ｘ／ｙ≰３．１）で示される組成からなるスパッタリングターゲット。Ａｌ：１００ｗｔｐｐｍ未満、Ｃａ：５００ｗｔｐｐｍ未満、Ｆｅ：１０ｗｔｐｐｍ未満、Ｎａ：５００ｗｔｐｐｍ未満、Ｎｉ：１０ｗｔｐｐｍ未満、Ｓｉ：１５０ｗｔｐｐｍ未満、Ｃｕ：１０ｗｔｐｐｍ未満、Ｋ：１５０ｗｔｐｐｍ未満であり、前記金属の含有合計量が１００ｗｔｐｐｍ未満であるスパッタリングターゲット。【選択図】なし
SPUTTERING TARGET FOR FORMATION OF SOLID ELECTROLYTE THIN FILM AND THIN FILM
固体電解質薄膜形成用スパッタリングターゲット及び薄膜
SATO KAZUYUKI (author)
2015-10-22
Patent
Electronic Resource
Japanese
IPC:
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
C04B
Kalk
,
LIME
/
H01B
CABLES
,
Kabel
/
H01M
Verfahren oder Mittel, z.B. Batterien, für die direkte Umwandlung von chemischer in elektrische Energie
,
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
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