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A platform for research: civil engineering, architecture and urbanism
JOINED BODY, SUBSTRATE FOR POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING JOINED BODY
PROBLEM TO BE SOLVED: To provide a joined body in which a ceramics member and a Cu member are joined at a low cost in a state where voids are reduced, and a method for producing the same.SOLUTION: A joined part 13 is formed between a ceramics member 11 and a Cu member 12, an active metal compound region 16 made of a compound including active metal is formed on the side of the ceramics member 11 of the joined part 13, and the concentration of Al in the joined part 13 in the thickness range of 0.5 to 3 μm toward the side of the Cu member 12 from one side forming the side of the Cu member 12 of the active metal compound region 16 lies in the range of 0.5 to 15 at%.
【課題】セラミックス部材とＣｕ部材とが、ボイドが少ない状態で、かつ低コストに接合された接合体、およびその製造方法を提供することを目的とする。【解決手段】セラミックス部材１１とＣｕ部材１２との間には、接合部１３が形成され、接合部１３のセラミックス部材１１側には、活性金属を含む化合物からなる活性金属化合物領域１６が形成され、活性金属化合物領域１６のＣｕ部材１２側をなす一面から、Ｃｕ部材１２側に向かって０．５μｍ〜３μｍの厚み範囲における接合部１３のＡｌ濃度が０．５ａｔ％以上、１５ａｔ％以下の範囲である。【選択図】図２
JOINED BODY, SUBSTRATE FOR POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING JOINED BODY
PROBLEM TO BE SOLVED: To provide a joined body in which a ceramics member and a Cu member are joined at a low cost in a state where voids are reduced, and a method for producing the same.SOLUTION: A joined part 13 is formed between a ceramics member 11 and a Cu member 12, an active metal compound region 16 made of a compound including active metal is formed on the side of the ceramics member 11 of the joined part 13, and the concentration of Al in the joined part 13 in the thickness range of 0.5 to 3 μm toward the side of the Cu member 12 from one side forming the side of the Cu member 12 of the active metal compound region 16 lies in the range of 0.5 to 15 at%.
【課題】セラミックス部材とＣｕ部材とが、ボイドが少ない状態で、かつ低コストに接合された接合体、およびその製造方法を提供することを目的とする。【解決手段】セラミックス部材１１とＣｕ部材１２との間には、接合部１３が形成され、接合部１３のセラミックス部材１１側には、活性金属を含む化合物からなる活性金属化合物領域１６が形成され、活性金属化合物領域１６のＣｕ部材１２側をなす一面から、Ｃｕ部材１２側に向かって０．５μｍ〜３μｍの厚み範囲における接合部１３のＡｌ濃度が０．５ａｔ％以上、１５ａｔ％以下の範囲である。【選択図】図２
JOINED BODY, SUBSTRATE FOR POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING JOINED BODY
接合体、パワーモジュール用基板、パワーモジュール、及び、接合体の製造方法
TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author)
2015-11-05
Patent
Electronic Resource
Japanese
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