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METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE
PROBLEM TO BE SOLVED: To provide a method for manufacturing a joined body that can favorably join a ceramics member and a Cu member with each other and to provide a substrate for power module that has ceramics member and a Cu member strongly joined with each other.SOLUTION: The joined body 26 is formed by laminating a brazing filler metal 22, a metal active material 23 and a Cu member 24 in this order on one surface 21a of a ceramics member 21 and performing heat treatment. The brazing filler metal 22 uses a brazing filler metal including Cu and a eutectic element which eutectically reacts with the Cu. The eutectic element is selected from one kind or two or more kinds of elements selected among Ca, Ge, Sr, Sn, Sb, Ba, La, Ce and Al.
【課題】セラミックス部材とＣｕ部材とを良好に接合することができる接合体の製造方法、及び、セラミックス部材とＣｕ部材とを強固に接合したパワーモジュール用基板を提供することを目的とする。【解決手段】セラミックス部材２１の一面２１ａ側に、ろう材２２、金属活性材２３、およびＣｕ部材２４を順に積層し、加熱処理によって接合体２６を形成する。ろう材２２としては、Ｃｕと、このＣｕと共晶反応する共晶元素とを含むろう材を用いる。共晶元素としては、Ｃａ，Ｇｅ，Ｓｒ，Ｓｎ，Ｓｂ，Ｂａ，Ｌａ，Ｃｅ，Ａｌのうちから選択される１種または２種以上の元素から選択される。【選択図】図２
METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE
PROBLEM TO BE SOLVED: To provide a method for manufacturing a joined body that can favorably join a ceramics member and a Cu member with each other and to provide a substrate for power module that has ceramics member and a Cu member strongly joined with each other.SOLUTION: The joined body 26 is formed by laminating a brazing filler metal 22, a metal active material 23 and a Cu member 24 in this order on one surface 21a of a ceramics member 21 and performing heat treatment. The brazing filler metal 22 uses a brazing filler metal including Cu and a eutectic element which eutectically reacts with the Cu. The eutectic element is selected from one kind or two or more kinds of elements selected among Ca, Ge, Sr, Sn, Sb, Ba, La, Ce and Al.
【課題】セラミックス部材とＣｕ部材とを良好に接合することができる接合体の製造方法、及び、セラミックス部材とＣｕ部材とを強固に接合したパワーモジュール用基板を提供することを目的とする。【解決手段】セラミックス部材２１の一面２１ａ側に、ろう材２２、金属活性材２３、およびＣｕ部材２４を順に積層し、加熱処理によって接合体２６を形成する。ろう材２２としては、Ｃｕと、このＣｕと共晶反応する共晶元素とを含むろう材を用いる。共晶元素としては、Ｃａ，Ｇｅ，Ｓｒ，Ｓｎ，Ｓｂ，Ｂａ，Ｌａ，Ｃｅ，Ａｌのうちから選択される１種または２種以上の元素から選択される。【選択図】図２
METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE
接合体の製造方法、パワーモジュール用基板の製造方法
TERASAKI NOBUYUKI (author) / NAGATOMO YOSHIYUKI (author)
2015-11-24
Patent
Electronic Resource
Japanese
JOINED BODY, SUBSTRATE FOR POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING JOINED BODY
| European Patent Office | 2015
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