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A platform for research: civil engineering, architecture and urbanism
METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE
PROBLEM TO BE SOLVED: To provide a method for manufacturing a joined body that can securely perform joining without applying a large load in a lamination direction when joining a copper member with an aluminum layer formed on the surface of a ceramic member.SOLUTION: The method for manufacturing a joined body comprises: an aluminum layer formation step S01 of forming the aluminum layer on the surface of a ceramic member; a Ti material and copper member laminating step S02 of laminating the copper member on the surface of the aluminum layer through a Ti material; an ultrasonic junction step S03 of applying an ultrasonic wave to the aluminum layer, the Ti material and the copper member which are laminated and performing joining between the aluminum layer and the Ti material and between the Ti material and the copper member, respectively; and a solid-phase diffusion junction step S04 of applying heat treatment to the aluminum layer, the Ti material and the copper member which are ultrasonically joined and performing solid-phase diffusion junction between the aluminum layer and the Ti material and between the Ti material and the copper member, respectively.SELECTED DRAWING: Figure 2
【課題】セラミックス部材の表面に形成されたアルミニウム層に対して銅部材を接合する際に、積層方向に大きな荷重をかけることなく、確実に接合を行うことが可能な接合体の製造方法の提供。【解決手段】セラミックス部材の表面に前記アルミニウム層形成するアルミニウム層形成工程Ｓ０１と、前記アルミニウム層の表面に、Ｔｉ材を介して、前記銅部材を積層するＴｉ材及び銅部材積層工程Ｓ０２と、積層されたアルミニウム層、Ｔｉ材及び銅部材に対して、超音波を付与し、前記アルミニウム層と前記Ｔｉ材、前記Ｔｉ材と前記銅部材をそれぞれ接合する超音波接合工程Ｓ０３と、超音波接合されたアルミニウム層、Ｔｉ材及び銅部材に対して、加熱処理を行い、前記アルミニウム層と前記Ｔｉ材、前記Ｔｉ材と前記銅部材をそれぞれ固相拡散接合する固相拡散接合工程Ｓ０４とからなる接合体の製造方法。【選択図】図２
METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE
PROBLEM TO BE SOLVED: To provide a method for manufacturing a joined body that can securely perform joining without applying a large load in a lamination direction when joining a copper member with an aluminum layer formed on the surface of a ceramic member.SOLUTION: The method for manufacturing a joined body comprises: an aluminum layer formation step S01 of forming the aluminum layer on the surface of a ceramic member; a Ti material and copper member laminating step S02 of laminating the copper member on the surface of the aluminum layer through a Ti material; an ultrasonic junction step S03 of applying an ultrasonic wave to the aluminum layer, the Ti material and the copper member which are laminated and performing joining between the aluminum layer and the Ti material and between the Ti material and the copper member, respectively; and a solid-phase diffusion junction step S04 of applying heat treatment to the aluminum layer, the Ti material and the copper member which are ultrasonically joined and performing solid-phase diffusion junction between the aluminum layer and the Ti material and between the Ti material and the copper member, respectively.SELECTED DRAWING: Figure 2
【課題】セラミックス部材の表面に形成されたアルミニウム層に対して銅部材を接合する際に、積層方向に大きな荷重をかけることなく、確実に接合を行うことが可能な接合体の製造方法の提供。【解決手段】セラミックス部材の表面に前記アルミニウム層形成するアルミニウム層形成工程Ｓ０１と、前記アルミニウム層の表面に、Ｔｉ材を介して、前記銅部材を積層するＴｉ材及び銅部材積層工程Ｓ０２と、積層されたアルミニウム層、Ｔｉ材及び銅部材に対して、超音波を付与し、前記アルミニウム層と前記Ｔｉ材、前記Ｔｉ材と前記銅部材をそれぞれ接合する超音波接合工程Ｓ０３と、超音波接合されたアルミニウム層、Ｔｉ材及び銅部材に対して、加熱処理を行い、前記アルミニウム層と前記Ｔｉ材、前記Ｔｉ材と前記銅部材をそれぞれ固相拡散接合する固相拡散接合工程Ｓ０４とからなる接合体の製造方法。【選択図】図２
METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE
接合体の製造方法、及び、パワーモジュール用基板の製造方法
OHASHI TOYO (author) / NAGATOMO YOSHIYUKI (author)
2017-09-21
Patent
Electronic Resource
Japanese
JOINED BODY, SUBSTRATE FOR POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING JOINED BODY
| European Patent Office | 2015
METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE
| European Patent Office | 2015