A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
SOLDER BONDED BODY
PROBLEM TO BE SOLVED: To provide a solder bonded body in which a solder material is bonded to the surface of non-oxide ceramic as an adherend without the need for a special bonding device.SOLUTION: A solder material brought into contact with a non-oxide ceramic adherend is heat-treated at a temperature that is higher than or equal to a solidus temperature but lower than or equal to a liquidus temperature, to bond a solder layer to the adherend, thereby obtaining a solder bonded body.
【課題】はんだ材料が、特殊な接着装置を要せずに被着体である非酸化物セラミックスの表面に接着したはんだ接着体を提供する。【解決手段】非酸化物セラミックスの被着体上に接触させたはんだ材料を、固相線温度以上、液相線温度以下の温度で熱処理してはんだ層を前記被着体に接着することで得られるはんだ接着体である。【選択図】なし
SOLDER BONDED BODY
PROBLEM TO BE SOLVED: To provide a solder bonded body in which a solder material is bonded to the surface of non-oxide ceramic as an adherend without the need for a special bonding device.SOLUTION: A solder material brought into contact with a non-oxide ceramic adherend is heat-treated at a temperature that is higher than or equal to a solidus temperature but lower than or equal to a liquidus temperature, to bond a solder layer to the adherend, thereby obtaining a solder bonded body.
【課題】はんだ材料が、特殊な接着装置を要せずに被着体である非酸化物セラミックスの表面に接着したはんだ接着体を提供する。【解決手段】非酸化物セラミックスの被着体上に接触させたはんだ材料を、固相線温度以上、液相線温度以下の温度で熱処理してはんだ層を前記被着体に接着することで得られるはんだ接着体である。【選択図】なし
SOLDER BONDED BODY
はんだ接着体
KURIHARA YOSHIAKI (author) / YOSHIDA MASATO (author) / NOJIRI TAKESHI (author) / ADACHI SHUICHIRO (author)
2016-01-14
Patent
Electronic Resource
Japanese
Thermal ratcheting of solder-bonded elastic and elastoplastic layers
| British Library Online Contents | 2008